Thermally conductive silicone composition
TW202631890APending Publication Date: 2026-08-01DOW SILICONES CORP
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-09-08
- Publication Date
- 2026-08-01
Abstract
A thermally conductive composition comprises (A) an organopolysiloxane having an average formula (I) and a dynamic viscosity of
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