Thermally conductive composite with monocarbinol additive

Abstract

The present invention is a composition comprising, based on the weight of the composition, a) a thermally conductive filler; b) a polyorganosiloxane functionalized with at least two ethylenically unsaturated groups; and c) a polyorganosiloxane functionalized with two terminal carbinol groups. The composition of the present invention provides a thermally conductive polyorganosiloxane composite with an excellent balance of thixotropic properties and concomitant flowability, with reduced filler settling.