Thermally conductive silicone composition
A thermally conductive composition with a unique blend of silicon carbide, alumina, and zinc oxide fillers addresses the challenge of high thermal conductivity and applicability in electronic devices, ensuring efficient heat dissipation and easy application.
Patent Information
- Application Number
- TW114136746
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-10-10
- Filing Date
- 2025-09-24
- Publication Date
- 2026-08-01
AI Technical Summary
Existing thermally conductive polysiloxane compositions face challenges in achieving both high thermal conductivity and easy applicability, with high filler loading increasing viscosity and compromising electrical insulation properties, and mismatched filler ratios limiting thermal conductivity.
A thermally conductive composition comprising a novel combination of at least three different types and sizes of thermally conductive fillers, including silicon carbide, alumina, and zinc oxide, with specific weight percentages and particle sizes, to achieve an extrusion rate of 20 g/min and thermal conductivity of at least 10.0 W/m*K.
The composition ensures effective heat dissipation and easy application, meeting the demands of high thermal conductivity and extrusion rate requirements for advanced electronic devices.