Thermally conductive silicone composition

TW202631898APending Publication Date: 2026-08-01DOW SILICONES CORP
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
DOW SILICONES CORP
Filing Date
2025-09-24
Publication Date
2026-08-01
Patent Text Reader

Abstract

A thermally conductive composition comprises: (A) an organopolysiloxane represented by an average formula (I) and a dynamic viscosity of
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