Insulating components

Abstract

The present invention aims to provide an insulating composition comprising hollow silicon oxide particles, capable of forming a film with excellent mechanical properties, electrical properties (low relative permittivity, low dielectric tangent, etc.), and insulation properties; and to provide a substrate having the film. An insulating composition comprises 5-70 vol% hollow silicon oxide particles and resin, wherein the median particle size (D50) of the secondary particles of the hollow silicon oxide particles is 0.2-10 µm, and the specific gravity of the hollow silicon oxide particles is 0.3 g / cm³ or more and less than 1.00 g / cm³, and less than the specific gravity of the resin.