Conductive particles, conductive materials and connecting structures

TW202631906APending Publication Date: 2026-08-01SEKISUI CHEMICAL CO LTD
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
SEKISUI CHEMICAL CO LTD
Filing Date
2025-10-08
Publication Date
2026-08-01

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Abstract

This invention provides conductive particles capable of improving acid resistance. The conductive particles of this invention comprise substrate particles and a conductive layer disposed on the surface of the substrate particles. The conductive layer contains nickel and cobalt, and the average cobalt content in 100% by weight of the region extending from the outer surface of the conductive layer inwards to the outer surface side with a thickness of 1 / 2 is greater than the average cobalt content in 100% by weight of the region extending from the inner surface of the conductive layer inwards to the inner surface side with a thickness of 1 / 2.
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