Polishingcomposition,polishingmethod,andmethodforproducingsemiconductorsubstrate
TW202631914APending Publication Date: 2026-08-01FUJIMI INCORPORATED
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- FUJIMI INCORPORATED
- Filing Date
- 2025-09-10
- Publication Date
- 2026-08-01
Abstract
Provided is a polishing composition that can polish a carbon film at a high polishing removal rate. A polishing composition containing abrasive grains and a nonionic surfactant, wherein the polishing composition is used for polishing an object to be polished containing a carbon film.
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