Grinding methods, slurries and abrasives

Abstract

A polishing method includes a polishing step of polishing a resin portion of a member having a resin portion containing a resin material using a slurry, wherein the slurry contains abrasive grains having silicon oxide particles and an aluminum component present on the surface of the silicon oxide particles, and the aluminum component comprises at least one selected from the group consisting of aluminum acetate, aluminum chloride, and such derivatives. A slurry is used to polish the resin portion of a member having a resin portion containing a resin material, wherein the slurry contains abrasive grains having silicon oxide particles and an aluminum component present on the surface of the silicon oxide particles, and the aluminum component comprises at least one selected from the group consisting of aluminum acetate, aluminum chloride, and such derivatives.