Colloidal silica and chemical mechanical polishing composition comprising the same

TW202631921APending Publication Date: 2026-08-01ENF TECH CO LTD +1
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
ENF TECH CO LTD
Filing Date
2025-12-26
Publication Date
2026-08-01

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Abstract

eV in an X-ray photoelectron spectroscopy (XPS) spectrum, an intensity of the first peak is greater than an intensity of the second peak, in a storage modulus (G', Pa) and a loss modulus (G”, Pa) according to shear strain (%) obtained under conditions as below, a crossover between the storage modulus (G') and the loss modulus (G”) occurs at a shear strain of
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