Chemical binding of surface polymer to epoxy material

TW202631922APending Publication Date: 2026-08-01YIELD ENGINEERING SYSTEMS INC
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-11-06
Publication Date
2026-08-01

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Abstract

The present disclosure relates to the chemical binding of surface polymers to epoxy materials. More specifically, the present disclosure relates to the adhesion of an epoxy material to a substrate by bonding of functional groups present in a surface polymer formed on a substrate to functional groups present in the epoxy material.
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