Adhesive film and winding

TW202631923APending Publication Date: 2026-08-01SEKISUI CHEMICAL CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
SEKISUI CHEMICAL CO LTD
Filing Date
2025-11-14
Publication Date
2026-08-01
Patent Text Reader

Abstract

The object of the present invention is to provide an adhesive film that can suppress paste overflow even when stored in a roll, and a roll of the adhesive film. The present invention is an adhesive film having an adhesive layer that satisfies at least one of the following first configuration or the following second configuration. First configuration: When the shear storage modulus of elasticity at T℃ measured by dynamic viscoelasticity measurement is set as G'(T), the following formulas (A) and (B) are satisfied simultaneously. 10≦G'(0) / G'(200)≦20000・・・(A) 105 Pa≦G'(0)≦1010 Pa・・・(B) Second configuration: When the load F(gf) measured by a t-second probe contact is set as F(t), the following formula (C) is satisfied. 0.60≦F(30) / F(1)≦0.96・・・(C) none
Need to check novelty before this filing date? Find Prior Art