Film adhesives, die-cutting bonding monolithic films, and semiconductor devices and methods for manufacturing the same.

Abstract

This disclosure provides a film-like adhesive comprising: an epoxy resin; a phenolic resin; at least one resin component selected from the group consisting of elastomers and thermoplastic resins; an inorganic filler; and a compound having a main chain and side chains bonded to the main chain, and containing a polar group on at least one of the main chain and side chains. The inorganic filler is a filler composed of a substance with a thermal conductivity of 10–2000 W / (m·K) at 20°C. Based on the total amount of the film-like adhesive, the content of the inorganic filler is 50–90% by mass.

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