Thermal bonding sheet, and dicing tape equipped thermal bonding sheet

TW202631926APending Publication Date: 2026-08-01NITTO DENKO CORP
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
NITTO DENKO CORP
Filing Date
2025-02-05
Publication Date
2026-08-01

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    Figure TWG2TA001069979_002
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    Figure TWG2TA001069979_003
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Abstract

To provide a thermal bonding sheet including a close adhesion layer with good dispersibility of an organic binder. Provided is a thermal bonding sheet including: a sinter precursor layer including sinterable particles; and a close adhesion layer superposed on one surface of the sinter precursor layer. The close adhesion layer includes an organic binder and the sinterable particles, a content percentage of the sinterable particles in the close adhesion layer is
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