Adhesive compositions, adhesive sheets and bonding agents
TW202631927APending Publication Date: 2026-08-01NITTO DENKO CORP
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- NITTO DENKO CORP
- Filing Date
- 2025-09-18
- Publication Date
- 2026-08-01
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Abstract
This invention provides an adhesive composition that achieves the initial adhesion required for bonding. Furthermore, due to the minimal adhesion force after voltage application, it achieves a large adhesion force reduction rate and exhibits excellent electrical peel performance. The adhesive composition of this invention comprises a polymer and an electrolyte, wherein the HSP distance between the reduced cationic product of the electrolyte and the polymer is 2.5 MPa0.5 to 5.0 MPa0.5. The adhesive layer formed from the adhesive composition has an ionic conductivity of 5.0 μS / m or higher, and the adhesion force recovery rate of the adhesive layer formed from the adhesive composition after 2 minutes is 60% or higher.
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