Adhesive compositions, adhesive sheets and bonding agents

TW202631927APending Publication Date: 2026-08-01NITTO DENKO CORP
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
NITTO DENKO CORP
Filing Date
2025-09-18
Publication Date
2026-08-01

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Abstract

This invention provides an adhesive composition that achieves the initial adhesion required for bonding. Furthermore, due to the minimal adhesion force after voltage application, it achieves a large adhesion force reduction rate and exhibits excellent electrical peel performance. The adhesive composition of this invention comprises a polymer and an electrolyte, wherein the HSP distance between the reduced cationic product of the electrolyte and the polymer is 2.5 MPa0.5 to 5.0 MPa0.5. The adhesive layer formed from the adhesive composition has an ionic conductivity of 5.0 μS / m or higher, and the adhesion force recovery rate of the adhesive layer formed from the adhesive composition after 2 minutes is 60% or higher.
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