Adhesive film, adhesive film with metal layer, component for wiring formation, method for forming wiring layer and component for wiring formation

Abstract

An adhesive film comprising epoxy resin and phenolic resin, wherein the epoxy equivalent of the epoxy resin is 150 g / eq or less. An adhesive film with a metal layer comprising a metal layer and an adhesive layer disposed on the metal layer, wherein the adhesive layer comprises epoxy resin and phenolic resin, and the epoxy equivalent of the epoxy resin is 150 g / eq or less. A wiring forming component wherein the adhesive layer and the metal layer are separately disposed, and the adhesive layer can be bonded to the metal layer in use, wherein the adhesive layer of the wiring forming component comprises epoxy resin and phenolic resin, and the epoxy equivalent of the epoxy resin is 150 g / eq or less.

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