Adhesive film

TW202631941APending Publication Date: 2026-08-01MITSUI CHEM ICT MATERIA INC
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
MITSUI CHEM ICT MATERIA INC
Filing Date
2025-09-25
Publication Date
2026-08-01

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Abstract

An adhesive film (10) includes a substrate layer (A) and an adhesive resin layer (C), the adhesive resin layer (C) comprising thermally expandable microspheres, wherein the ratio (Ra2 / Ra1) of the arithmetic mean roughness Ra2 of the adhesive film (10) after a specified treatment based on a specified method 2 to the arithmetic mean roughness Ra1 after a specified treatment based on a specified method 1 is 0.40 or more. An adhesive film (10) includes a substrate layer (A) and an adhesive resin layer (C), in which the adhesive resin layer (C) contains thermally expandable microspheres, and a ratio (Ra2 / Ra1) of an arithmetic average roughness Ra2, measured by a predetermined method 2 after a specified treatment, to an arithmetic average roughness Ra1, measured by a predetermined method 1 after a specified treatment, is 0.40 or more.
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