Adhesive film

TW202631942APending Publication Date: 2026-08-01MITSUI CHEM ICT MATERIA INC
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
MITSUI CHEM ICT MATERIA INC
Filing Date
2025-09-25
Publication Date
2026-08-01

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Abstract

comprises a substrate layer (A) and an adhesive resin layer (C), wherein the adhesive resin layer (C) contains thermally expandable microspheres containing a thermosetting resin.
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