Photosensitive adhesive composition, photosensitive adhesive dry film, patterning method, and method for manufacturing laminate

Abstract

This invention employs a photosensitive adhesive composition comprising an acrylic resin, an epoxy-containing compound (excluding those equivalent to the acrylic resin), and a photocationic polymerization initiator. The acrylic resin has structural units derived from acrylic monomers containing functional groups that react with carboxyl (-COOH) groups, has a glass transfer temperature below 0°C, and a weight-average molecular weight of 200,000 or higher. This photosensitive adhesive composition enables the bonding of transparent substrates to other substrates without easily causing whitening of the transparent substrate during bonding, and achieves good resolution when forming patterns.

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