Hardening adhesive composition and laminate

Abstract

This invention provides a curable adhesive composition and a laminate that can shorten the process time when manufacturing composite components for heat-resistant applications. The curable adhesive composition of this invention comprises a thermosetting component and a thermoplastic component. The curable adhesive composition has a heat release of 10 mJ / mg or more as measured by DSC at 25~300°C before heat treatment, a heat release ratio (heat release after heat treatment / heat release before heat treatment) of less than 1.0 before and after heat treatment at 150°C / 5min, and a storage modulus of elasticity of 1×10⁵ Pa or more as measured by DMA at 150°C after heat treatment at 150°C / 5min.

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