Semiconductor film adhesives and their manufacturing methods, adhesive tapes and their manufacturing methods, semiconductor devices and their manufacturing methods, and methods for manufacturing coating solutions.

Abstract

This invention discloses a film-like adhesive for semiconductors. The film-like adhesive for semiconductors comprises: a thermosetting resin, a thermoplastic resin, a thermally conductive filler, and a polymer, wherein the polymer has a main chain and side chains bonded to the main chain, and at least one of the main chain and side chains contains a polar group. Based on the total amount of the film-like adhesive for semiconductors, the content of the thermally conductive filler is 50% by mass or more.

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