Film adhesives, die-cutting bonding monolithic films, and semiconductor devices and methods for manufacturing the same.

TW202631946APending Publication Date: 2026-08-01RESONAC CORP
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
RESONAC CORP
Filing Date
2025-10-28
Publication Date
2026-08-01

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Abstract

This invention discloses a film-like adhesive containing thermally conductive particles, epoxy resin, and phenolic resin. In one embodiment, the phenolic resin comprises a phenolic resin with a hydroxyl equivalent of 185 g / eq or more. In another embodiment, the phenolic resin comprises a phenolic resin having a biphenyl backbone.
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