Polishing composition and polishing method using the same

Abstract

The present invention provides a grinding composition comprising: grinding particles having a positive surface potential by being modified with a silane coupling agent, having an average secondary particle size of 45 nm to 100 nm, and a silanol group density of greater than 0.0 groups / nm² and less than 3.0 groups / nm²; a surfactant being an alkyl phosphate having 6 to 18 carbon atoms; and an aqueous dispersion medium. The present disclosure provides a polishing composition including polishing particles whose surface is modified with a silane coupling agent to have a positive surface potential, an average secondary particle size of 45 nm to 100 nm, and a silanol group density of greater than 0.0 / nm2 and less than 3.0 / nm2; a surfactant having alkyl phosphates with carbon atoms from 6 to 18; and an aqueous dispersion medium.