Composition, method of treating metal-containing film and method of manufacturing electronic device

TW202631956APending Publication Date: 2026-08-01SAMSUNG ELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
SAMSUNG ELECTRONICS CO LTD
Filing Date
2025-09-25
Publication Date
2026-08-01

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    Figure TWG2TA001070552_003
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Abstract

or less, wherein the oxidizing agent includes hydrogen peroxide, an iodine-containing compound, or any combination thereof, and the etching controller includes a hydroxyl-free and nitrogen-containing compound, a method of treating a metal-containing film using the composition, and a method of manufacturing an electronic device by using the composition.
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