Etching solution composition and etching method

TW202631957APending Publication Date: 2026-08-01KAO CORP
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
KAO CORP
Filing Date
2021-10-20
Publication Date
2026-08-01
Patent Text Reader

Abstract

This invention provides an etching solution composition in one embodiment that can reduce etching unevenness. The invention relates to an etching solution composition for etching a layer containing at least one metal, wherein the etching solution composition contains an etching inhibitor, an acid containing at least nitric acid, and water, with a pH value below 1; the etching inhibitor is selected from at least one nitrogen-containing compound selected from polyalkylimide and polymers containing structural units derived from diallylamine.
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