Etching solution composition and etching method
TW202631957APending Publication Date: 2026-08-01KAO CORP
View PDF 0 Cites 0 Cited by
Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- KAO CORP
- Filing Date
- 2021-10-20
- Publication Date
- 2026-08-01
Abstract
This invention provides an etching solution composition in one embodiment that can reduce etching unevenness. The invention relates to an etching solution composition for etching a layer containing at least one metal, wherein the etching solution composition contains an etching inhibitor, an acid containing at least nitric acid, and water, with a pH value below 1; the etching inhibitor is selected from at least one nitrogen-containing compound selected from polyalkylimide and polymers containing structural units derived from diallylamine.
Need to check novelty before this filing date? Find Prior Art