Manufacturing methods for components, cleaned processed objects, and electronic devices.

Abstract

This invention provides a composition that exhibits excellent particle removal and organic matter removal properties when applied to a workpiece containing a hydrophobic surface derived from polycrystalline or amorphous silicon that has undergone CMP treatment. Furthermore, a method for manufacturing a cleaned workpiece and a method for manufacturing an electronic device are provided. The composition of this invention is for cleaning a workpiece subjected to chemical mechanical polishing (CMP), comprising: a nonionic surfactant having a polyoxyalkylene chain and a hydrophilicity-lipophilicity balance of 8.5 to 14; and a specific compound (excluding zwitterionic compounds) selected from the group consisting of inorganic acids, amino alcohols, organic acids, quaternary ammonium compounds, and aliphatic polyamines, wherein the organic acid has at least one group selected from the group consisting of carboxylic acid groups, phosphonic acid groups, and sulfonic acid groups, and the mass ratio of the content of the nonionic surfactant to the total content of the specific compound is 0.001 to 1500.