Chemical solutions for semiconductor substrates, cleaning methods for semiconductor substrates, and manufacturing methods for electronic components.

Abstract

This invention provides a cleaning solution for semiconductor substrates, a cleaning method for semiconductor substrates using the aforementioned cleaning solution, and a method for manufacturing electronic components. The cleaning solution for semiconductor substrates exhibits excellent ability to suppress copper depressions and remove benzotriazole residues remaining on copper regions when applied to semiconductor substrates that have undergone chemical mechanical polishing and contain embedded copper regions. The cleaning solution for semiconductor substrates of this invention contains: a purine compound selected from purines and purine derivatives; a tertiary alkylamine compound lacking a hydroxyl group and a primary amino group; a tertiary ammonium compound; and water. The mass ratio of the content of the tertiary alkylamine compound to the content of the purine compound is 0.010 to 3, and the pH exceeds 7.0.