Copper-silver alloy wire and its manufacturing method

TW202632022APending Publication Date: 2026-08-01SHOWA ELECTRIC WIRE & CABLE CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
SHOWA ELECTRIC WIRE & CABLE CO LTD
Filing Date
2026-01-22
Publication Date
2026-08-01

Smart Images

  • Figure TWG2TA001071763_001
    Figure TWG2TA001071763_001
  • Figure TWG2TA001071763_002
    Figure TWG2TA001071763_002
  • Figure TWG2TA001071763_003
    Figure TWG2TA001071763_003
Patent Text Reader

Abstract

This invention provides an ultra-fine copper-silver alloy wire with excellent tensile strength. A method for manufacturing a copper-silver alloy wire is characterized by comprising at least the following steps: (a) obtaining raw materials by continuous casting of a copper-silver alloy, wherein the silver content of the copper-silver alloy is 10 wt% or more and 25 wt% or less, and the remainder consists of copper and unavoidable impurities; and (b) performing at least one wire drawing and heat treatment on the raw materials to obtain the wire, wherein the heat treatment in (b) includes an intermediate heat treatment performed only when the workability is 1.5 or more and 3.5 or less, and the wire obtained after (b) has a wire diameter of 0.050 mm or less, a workability of 10 or more, a tensile strength of 1500 MPa or more, and a conductivity of 40% IACS or more. Furthermore, it is preferable to obtain wire with a diameter of 0.020 mm or less, a processing degree of 13 or more, and a tensile strength of 1700 MPa or more; more preferably, wire with a diameter of 0.010 mm or less, a processing degree of 14 or more, and a tensile strength of 2000 MPa or more.
Need to check novelty before this filing date? Find Prior Art