Processing equipment and processing methods

TW202632024APending Publication Date: 2026-08-01NITTO DENKO CORP
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
NITTO DENKO CORP
Filing Date
2025-10-23
Publication Date
2026-08-01

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Abstract

The processing apparatus (1A) of the present invention includes a vacuum chamber (200), a heating section (Pm), a sputtering section (Ps), and a conveying section (70). The heating section (Pm) and the sputtering section (Ps) are located within the vacuum chamber (200). The heating section (Pm) heats the object (10) by irradiating it with microwaves under a reduced pressure atmosphere. The sputtering section (Ps) performs sputtering film formation on the object (10) under a reduced pressure atmosphere. The conveying section (70) sequentially conveys the object (10) to the heating section (Pm) and the sputtering section (Ps).
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