Method for removing the mask of sputtering

Abstract

A method for removing a sputtering mask: First, a substrate with a disposable mask is transported to a pre-set position; then, an adhesive application module presses down to adhere a single mask with tape; the tape is then vacuum-absorbed; next, the adhesive application module lifts up, the mask, still attached to the tape, leaves the substrate; finally, the substrate without the mask is transported to the next position. This method overcomes the difficulties encountered in removing disposable masks.

Description

Method for removing the mask from sputtering In the field of semiconductors or integrated circuits, sputter deposition / coating processes are completed using a disposable mask. This invention relates to a method for removing the disposable mask. A known fabrication technique involves creating at least one cover / metal mask on a substrate strip through an etching process. This mask blocks metal particles or impurities generated during the sputtering process, allowing for controlled deposition and accumulation of the sputtering material into a conductive thin film at the desired location on the substrate, thus improving precision. This mask has the following disadvantages: First, the etching process increases the cost of making the metal mask on the substrate, which is detrimental to market competition. Second, the metal shielding is not removed, which hinders the maintenance and cleaning of the substrate. Third, the substrate is sputtered multiple times to form a thin film, and the metal mask suffers repeated physical wear, which affects the accuracy of subsequent thin film deposition. Fourth, the metal shield increases the weight of the substrate, which may cause inconvenience in operating the sputtering equipment. To address the aforementioned shortcomings, the demand for "one-time" masking emerged. However, "one-time" masking faces several challenges that the industry urgently needs to overcome: First, the "one-time" mask is applied to the substrate, allowing it to be bonded to the substrate without an etching process, thus achieving a low-cost advantage and relatively enhancing market competitiveness. However, how to implement this mask is not a core technology of this invention, and therefore will not be discussed in detail here. Secondly, after the sputtering process is completed, the substrate removes the "one-time" mask, which offers the following advantages: First, after removal, the substrate does not require frequent maintenance or cleaning. Secondly, after removal, the "disposable" mask can be directly discarded, eliminating the need for management or storage and simplifying the operation process. Third, depending on the material or size requirements, "disposable" masks can be customized to flexibly handle the diversity of processes. Therefore, how to remove the "disposable" mask becomes the problem that this invention aims to overcome. To achieve the above objectives, the present invention provides a first method: first, a substrate with a disposable mask is transported to a preset position; then, an adhesive application module is pressed down to adhere a single mask with tape; the tape is vacuum-absorbed; next, the adhesive application module is lifted up, the mask is attached to the tape, and leaves the substrate; then, the substrate without a mask is transported to the next position. The present invention provides a second method: first, a substrate with disposable masks is transported to a preset position; then, an adhesive application module is pressed down to adhere multiple masks with tape; next, the adhesive application module is lifted up, the masks are attached with tape and leave the substrate; then, the substrate without masks is transported to the next position. To make the objectives, features and advantages of the present invention readily apparent, one or more preferred embodiments are described in detail below with reference to the accompanying drawings. Next, embodiments of this case will be described with reference to the accompanying drawings. In the drawings, the same reference numerals denote the same or similar structures or units. It is to be understood that the described embodiments are only some examples of this case, and not all embodiments. Other embodiments can be deduced based on the described examples, or constructions can be modified or varied as needed, all of which fall within the scope of protection of this case. In the following description, directional terms such as "up," "down," "left," "right," "front," "back," "inside," "outside," and "side" are used only for reference to the directions in the accompanying drawings. The use of directional terms is for the purpose of better and clearer description and understanding of this application, and does not imply that the described device or element must have a specific orientation, structure, or operation, and therefore should not be construed as a limitation on the technical content of this application. Unless specifically and explicitly stated otherwise, in the following description, "installed," "connected," "attached," or "on" should be interpreted broadly, including, for example, fixed connection, detachable connection, integral connection, mechanical connection, direct connection, indirect connection, or connection between two components. Those skilled in the art will understand the meaning of these terms in various embodiments, and even in the specific context, based on ordinary knowledge or experience. Unless otherwise stated, in the following description, "multiple" means two or more. In Figure 1, a method according to a first embodiment of the present invention includes the following steps: "Transfer the substrate with a disposable mask to the preset position 10", hereinafter referred to as step a; "Press down the adhesive module to attach the single mask 11 with tape", hereinafter referred to as step b1; "Vacuum Adsorption Tape 18", hereinafter referred to as step g; "The adhesive module is lifted, the masking tape is attached, and it leaves the substrate 12", hereinafter referred to as step c; "Detect whether the substrate has residual mask 13", hereinafter referred to as step d; "The substrate is moved to the removal position, and the residual mask is removed by the unloading gripper module 14", hereinafter referred to as step e; and "Transport the unmasked substrate to the next position 15", hereinafter referred to as step f. Step d is positioned between steps c and f. If the result of step d is "yes," step a proceeds through steps b1 and g to step c, then to step e and finally to step f, involving more steps. If the result is "no," step a proceeds through steps b1 and g to step c, then directly to step f, involving fewer steps. Therefore, step d is crucial, determining the direction of the process. As described above, this method focuses on the removal of "one-time" masks. As shown in Figure 2, a substrate 20 is typically a polygonal plate with dimensions of length × width × height. The substrate 20 has multiple masks 22, each mask 22 arrayed on one side of the substrate 20. Each mask 22 is a disposable item, controlling the area where sputtered material is deposited on the substrate 20 to become a conductive element 21. Therefore, the substrate 20 arrays the same number of conductive elements 21, which are on the same side as the masks 22. Furthermore, each conductive element 21 is a conductive thin film. The array referred to here generally means two conductive elements 21 separated by a shield 22, extending sequentially along the length of the substrate 20 as a row 23. Multiple rows 23 are arranged side by side, separated by a distance 25. Along the width of the substrate 20, the conductive elements 21 are arranged in a column 24, separating the two columns 24 of shield 22, with each column 24 separated by a different distance 26. As shown in Figure 3, a conveying device 40 transports the substrate 20 with a "disposable" cover to a preset position, completing step a. Preferably, the conveying device 40 is a mechanical conveying mechanism, such as a carrying platform, track, roller, rotary roller, chain, gear, pulley, belt, etc. The conveying device 40 is equipped with a computer (PC) and / or a programmable logic controller (PLC), allowing a user to supervise or operate the conveying device 40. Typically, the conveying device 40 has a positioning post 41 and a movable part 42, which moves relative to the positioning post 41 to position the substrate 20 on which the conveying device 40 is placed. If necessary, the positioning post 41 and the movable part 42 can be replaced with other components to facilitate the conveying device 40 delivering the substrate 20 to a preset position. Preferably, this preset position is located below an adhesive application module 30, and is a value preset by the PC or PLC. Of course, this preset value is optional or adjustable. Specifically, the adhesive application module 30 has a lifting mechanism 31. The lifting mechanism 31 is equipped with a pressing part 32 and an air extraction device 60. The pressing part 32 is separated from the substrate 20 by a height, and the two air extraction ports (unlabeled) of the air extraction device 60 are on both sides of the lifting mechanism 31. The adhesive application module 30 also includes a roll of adhesive tape 34, a recycle roll 35, and multiple rollers 36. The roll of tape 34 pulls out a piece of tape 33, which passes through each of the rollers 36, wraps around the pressing section 32, and connects to the recycle roll 35, giving the tape 33 tension. One side of the tape 33 is adhesive and is defined as the adhesive side. One back side of the tape 33 (unlabeled) is non-adhesive; therefore, the tape 33 is considered a single-sided adhesive. The back of the adhesive tape 33 contacts the pressing part 32, and the pressing part 32 causes a portion of the adhesive surface to protrude toward the substrate 20. Of course, the substrate 20 and the adhesive tape 33 are positioned opposite each other with a gap between them. In Figure 4, a virtual central axis 31A is drawn perpendicular to the substrate 20. The lifting mechanism 31 receives a message from the PC or PLC and lowers its height along the central axis 31A in a downward pressing direction 38. The pressing part 32 drives the adhesive tape 33 to move in the same direction, so that the adhesive surface 37 adheres to the top of the single mask 22, completing step b. In the PC or PLC settings, the lifting mechanism 31 tilts to the right at an angle 16 as shown in Figure 4, causing the pressing part 32 to swing to a virtual inclined line 31B. Because the shield 22 exceeds the conductive element 21 by a height difference 27, the adhesive tape 33, even when affected by the pressing part 32, will not allow the adhesive surface 37 to easily contact the conductive element 21. Of course, in the PC or PLC settings, the lifting mechanism 31 can also be tilted to the left as shown in Figure 4. As shown in Figure 5, the PC or PLC commands the air extraction device 60 to operate, and the two air extraction ports draw in air to generate a suction force, which can tightly adhere to the back of the tape 33, thus completing step g. As the lifting mechanism 31 swings to the right, the adhesive force of the adhesive surface 37 causes the shield 22 to tilt in the same direction. The adhesion force between the substrate 20 and the shield 22 is less than the adhesive force, so that the shield 22 tilts like a seesaw. The lifting mechanism 31 swings back to a position parallel to the central axis and rises in an upward direction 39. Under the suction of the vacuum, the tape 33 adheres tightly to the pressing part 32, so that the mask 22 is attached to the adhesive surface 37, and leaves the substrate 20 together with the lifting mechanism 31, completing step c. Referring back to Figure 3, at least one detection module 43 is mounted around the conveying device 40. The detection module 43 can be an image recognition system used to detect whether the mask remains on the substrate 20, thus completing step d. The result is "No". The substrate 20 is an unmasked substrate and is transported to the next position by the conveying device 40, completing step f. The result is "yes". According to the settings of the PC or PLC, the conveying device 40 transports the substrate 20 with residual masking to a removal position, adding step e. In other words, the detection result of step d determines whether step e is omitted, thus changing the number and order of execution steps in the process. Referring to Figure 6, the removal position referred to here is the position below one of the unloading gripper modules 50. According to the settings of the PC or PLC, the location of one or more residual masks 28 is digitally communicated to the unloading gripper module 50. The two grippers 51 of the unloading gripper module 50 move above the residual mask 28. Each gripper 51 has multiple grippers 52, capable of holding the residual mask 28 away from the substrate 20, completing step e. If necessary, the grippers 52 of the two grippers 51 can jointly hold the residual mask 28 for removal. Since the substrate 20 has no residual masking and belongs to the unmasked substrate category, it can be transported to the next location to complete step f. As shown in Figure 7, in a method of the second embodiment of the present invention, the original step b1 is changed to "pressing down the adhesive module to adhere multiple masks 19 with adhesive tape", and is defined as step b2. Furthermore, this method does not include step g of the first embodiment. The other steps and order of the method remain consistent with the first embodiment. In Figure 8, the adhesive application module does not have an air extraction device, and only the lifting mechanism 31 is retained. Following the downward pressing direction 38, the lifting mechanism 31 descends. The pressing part 32 reaches a dotted line position, causing the adhesive tape 33 to adhere to the preset mask 22. Along a moving direction 17, the pressing part 32 passes the conductive element 21 to a solid line position, while simultaneously sliding over the back of the adhesive tape 33. The tape roll pulls out more tape 33, increasing the area of ​​the adhesive surface 37 and allowing more masks 22 to be adhered, completing step b2. The conductive element 21 is lower than the mask 22 and will not be adhered to by the adhesive surface 37. As the lifting mechanism 31 moves, the rewind roll winds up the tape 33, pulling up more masks 22 from the substrate 20 with the adhesive surface 37. The lifting mechanism 31 moves upward, and the tape 33 contacts the pressing part 32 due to the rewind roll. The adhesive surface 37 adheres to the last mask 22. As the pressing part 32 leaves the substrate 20, step c is completed. Thus, the present invention removes the "one-time" mask from the substrate, making it a subsequent operation in the sputtering process, and enjoys the following advantages: First, after removal, the substrate does not require frequent maintenance or cleaning. Secondly, after removal, the "disposable" mask can be directly discarded, eliminating the need for management or storage and simplifying the operation process. Third, depending on the material or size requirements, "disposable" masks can be customized to flexibly handle the diversity of processes. Without departing from the broad concept of this case, those skilled in the art can understand and modify the above-described embodiments. Therefore, this case is not limited to the specific embodiments disclosed in the specification, and all modifications made in accordance with the spirit and technical scope of this case should be covered and protected by the textual content defined in the patent application. 10: "Transfer the substrate with disposable masks to the preset position." 11: "The adhesive application module presses down, attaching a single mask with tape." 12: "The adhesive application module lifts up, the mask with tape attached leaves the substrate." 13: "Detect whether there is any mask residue on the substrate." 14: "The substrate moves to the rejection position, and the residual mask is removed by the unloading gripper module." 15: "Transfer the substrate without masks to the next position." 16: Angle 17: Movement direction 18: "Vacuum suction of tape." 19: "The adhesive application module presses down, attaching multiple masks with tape." 20: Substrate 21: Conductive Component 22: Mask 23: Row 24: Column 25, 26: Distance 27: Height Difference 28: Residual Mask 30: Adhesive Application Module 31: Lifting Mechanism 31A: Central Shaft 31B: Inclined Line 32: Pressing Section 33: Adhesive Tape 34: Adhesive Tape Roll 35: Recycle Roll 36: Roller 37: Adhesive Surface 38: Downward Pressing Direction 39: Upward Lifting Direction 40: Conveying Device 41: Positioning Post 42: Moving Part 43: Detection Module 50: Unloading Gripper Module 51: Chuck 52: Gripper 60: Air Extraction Equipment Figure 1 illustrates the manufacturing process of the first embodiment of the present invention. Figure 2 shows a top view of a substrate with a disposable mask. Figure 3 shows the substrate being transported to a pre-set position. Figure 4 depicts the adhesive application module pressing down on and attaching a single mask. Figure 5 shows the adhesive application module, along with the single mask, leaving the substrate. Figure 6 illustrates the unloading clamp module removing the remaining mask from the substrate. Figure 7 illustrates the manufacturing process of the second embodiment of the present invention. Figure 8 shows the adhesive application module pressing down on and attaching multiple masks. 10: "Transfer the substrate with a disposable mask to the preset position" 11: "Press down the adhesive module to attach individual masking elements with tape." 12: "The adhesive module is lifted, the masking tape is attached, and it leaves the substrate." 13: "Check if there is any residual masking material on the substrate" 14: "The substrate is moved to the rejection position, and the residual mask is removed by the unloading gripper module." 15: "Transport the unmasked substrate to the next location" 18: Vacuum Adhesive Tape

Claims

1. A method for removing a sputtering mask includes the following steps: a) transferring a substrate with a disposable mask to a pre-set position (10); b) pressing down the adhesive module to adhere a single mask with tape (11); g) vacuum adsorbing the tape (18); c) lifting the adhesive module, with the mask attached to the tape, and removing it from the substrate (12); d) detecting whether the substrate has any mask residue (13), if the detection result is "no", the substrate (20) with no mask residue (28) proceeds to the next step; and f) transporting the substrate without a mask to the next position (15). A method for removing a sputtering mask includes the following steps: a) transferring a substrate with a disposable mask to a preset position (10); b) pressing down an adhesive module to adhere multiple masks with tape (11); c) lifting the adhesive module, with the mask attached to the tape, and removing it from the substrate (12); d) detecting whether the substrate has any mask residue (13), if the detection result is "no", the substrate (20) with no mask residue (28) proceeds to the next step; and f) transporting the substrate without a mask to the next position (15). The method for removing the sputtering mask as described in claim 1 or 2, wherein... If the detection result of step d is "yes", the mask (28) remains on the substrate (20) and proceeds to step e; e) the substrate is moved to the removal position and the remaining mask is removed by the unloading clamp module (14); step e is between step d and step f, and step c indirectly enters step f via step e. The method for removing the sputtering mask as described in claim 1 or 2, wherein... The adhesive module (30) uses a pressing part (32) with height adjustment to drive the adhesive surface (37) of the tape (33) to remove the "one-time" mask (22) of the substrate (20). The method for removing the sputtering mask as described in claim 1, wherein... The adhesive module (30) uses a lifting mechanism (31) to operate the pressing part (32) to raise and lower the height. The pressing part (32) presses down the adhesive tape (33) to stick a single "disposable" mask (22). The method for removing the sputtering mask as described in claim 5, wherein... The adhesive module (30) is equipped with a vacuum device (60) to make the tape (33) contact the pressing part (32) by vacuum adsorption, and remove the "disposable" mask (22) from the substrate (20). The method for removing the sputtering mask as described in claim 2, wherein... The adhesive module (30) uses a lifting mechanism (31) to manipulate the pressing part (32) to raise and lower the height. The pressing part (32) slides over the tape (33) to stick multiple "disposable" masks (22) to be removed from the substrate (20). The method for removing the sputtering mask as described in claim 3, wherein... Step d uses the detection module (43) to detect whether there is a residual mask (28) on the substrate (20), and step e uses the gripper (52) of the unloading gripper module (50) to hold the residual mask (28) away from the substrate (20).

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