Method for removing the mask of sputtering
The method of removing disposable masks from substrates during sputter deposition addresses cost and maintenance issues, enhancing process efficiency and flexibility by using adhesive tape and grippers to manage residual masks.
TW202632032AActive Publication Date: 2026-08-01DANTAI TECHNOLOGY CO LTD
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Patent Information
- Application Number
- TW114101824
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-01-16
- Publication Date
- 2026-08-01
- Estimated Expiration
- 2045-01-15
AI Technical Summary
Technical Problem
Existing sputter deposition processes using metal masks are costly due to etching, hinder maintenance and cleaning, suffer from physical wear affecting accuracy, and increase substrate weight, complicating equipment operation.
Method used
A method for removing disposable masks involves transporting substrates to a preset position, adhering masks with adhesive tape using a vacuum-adsorbed process, detecting residual masks, and removing them with unloading grippers, allowing for low-cost, low-maintenance operations.
Benefits of technology
Enables low-cost, low-maintenance substrate processing by eliminating the need for frequent cleaning and storage, simplifying operations, and accommodating diverse processes through customizable masks.
✦ Generated by Eureka AI based on patent content.
Abstract
A method for removing a sputtering mask: First, a substrate with a disposable mask is transported to a pre-set position; then, an adhesive application module presses down to adhere a single mask with tape; the tape is then vacuum-absorbed; next, the adhesive application module lifts up, the mask, still attached to the tape, leaves the substrate; finally, the substrate without the mask is transported to the next position. This method overcomes the difficulties encountered in removing disposable masks.
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