Methods of depositing metal-containing films having a composition gradient

Abstract

Methods of depositing metal-containing films having a composition gradient (i.e., gradient films) are described. The gradient films may be deposited by an atomic layer deposition (ALD) process or a chemical vapor deposition (CVD) process. The gradient film includes at least one metal selected from the group consisting of aluminum (Al), ruthenium (Ru), cobalt (Co), zinc (Zn), molybdenum (Mo), titanium (Ti), tungsten (W), tantalum (Ta), manganese (Mn), iridium (Ir), and copper (Cu). A metallic film is deposited on the gradient film, the metallic film including one or more of copper (Cu), ruthenium (Ru), cobalt (Co), tungsten (W), or molybdenum (Mo).

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