Molybdenum metallization and fill techniques for logic and memory

TW202632043APending Publication Date: 2026-08-01LAM RES CORP
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-01-21
Publication Date
2026-08-01

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Abstract

Provided herein are methods and related apparatus for deposition of a molybdenum in a feature. According to various embodiments, in some embodiments, the methods include single chamber metallization processes.
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