Semiconductor processing apparatus

Abstract

This application provides a semiconductor processing apparatus, including: a reaction chamber; a wafer support device for supporting a wafer, which is disposed within the reaction chamber; a heating assembly, including at least two lower heating element groups, wherein the lower heating element groups are arranged below the wafer support device and distributed radially along the wafer support device, each lower heating element group including a plurality of lower heating elements that are evenly distributed circumferentially along the wafer support device, and different lower heating element groups heat different target heating zones of the wafer support device; and a temperature measurement device, including at least two lower partitioned temperature measurement groups, each corresponding one-to-one to at least two lower heating element groups, for measuring the temperature of the target heating zone corresponding to its respective lower heating element group. Through the use of at least two lower partitioned temperature measurement groups, the apparatus is able to improve the stability of temperature control within the chamber.

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