Substrate processing apparatus

TW202632066APending Publication Date: 2026-08-01WONIK IPS CO LTD
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
WONIK IPS CO LTD
Filing Date
2025-12-15
Publication Date
2026-08-01

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Abstract

The present invention relates to a substrate processing apparatus and a substrate processing method, and more specifically, to a substrate processing apparatus and a substrate processing method for performing deposition on a substrate. The present invention discloses a substrate processing apparatus, comprising: a process chamber (100) forming an internal space, having a first exhaust port (101) and an exhaust portion (102) formed on its side, the first exhaust port (101) being connected to a vacuum pump, and the exhaust portion (102) being connected to a through hole (103) formed on the inner side of the internal space to connect the internal space with the first exhaust port (101); a chamber liner (200) disposed on the inner surface of the process chamber (100), forming a processing space (S) for processing the substrate inside, and having an exhaust flow path, the exhaust flow path being connected to the exhaust portion (102) to discharge process gas injected into the processing space (S) to the outside; and an exhaust liner (300) detachably disposed on the inner surface of the exhaust portion (102) and forming an exhaust flow path (S3), the exhaust flow path (S3) being used to discharge exhaust gas transmitted through the exhaust flow path through the first exhaust port (101). none
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