Metal compound thin film, method of forming the same and thin flim catalyst for water electrolysis

TW202632068APending Publication Date: 2026-08-01NAT SUN YAT SEN UNIV
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
NAT SUN YAT SEN UNIV
Filing Date
2023-10-31
Publication Date
2026-08-01

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Abstract

A metal compound thin film, a method of forming the same and a thin film catalyst for water electrolysis are provided. The method includes providing a substrate; and performing at least one ink-jet printing operation on the substrate to form the metal compound thin film on the substrate. The metal compound thin film includes plural thin films, and the thin films are not contacted with each other. Each of the ink-jet printing operations includes depositing a first precursor on the substrate by using a first nozzle of a ink-jet system; and depositing a second precursor on the substrate by using a second nozzle of the ink-jet system. The first precursor and the second precursor perform a chemical reaction to form the metal compound, and the metal compound thin film includes at least one layer of the metal compound. Therefore, patterning the thin film can be easily achieved, and chemical solution can be effectively saved.
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