ELECTROLESS Ni PLATING SOLUTION, ELECTROLESS Ni PLATING METHOD, Ni PLATING FILM, AND PRODUCT

Abstract

[Problem] To provide a Ni plating film with excellent bath stability, pattern precipitation properties, and plating deposition properties in minute pad areas, as well as superior solder joint reliability and surface smoothness, and an electroless Ni plating solution useful for forming the plating film. [Solution] A Ni plating film is formed on an object to be plated by performing surface treatment on the object to be plated using an electroless Ni plating solution containing at least S2+ and a Co metal, wherein the Co metal is contained in the form of Co2+ and Co3+.

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