Copper-coated resin particles and filler-containing paste

Abstract

This invention relates to copper-coated resin particles and a filler-containing paste comprising the copper-coated resin particles as fillers. The aforementioned copper-coated resin particles are copper-coated resin particles (10) comprising resin particles (11) composed of a resin composition and a copper coating layer (12) formed on the surface of the resin particles (11). The characteristics are: they contain silicon oxide in the range of 0.05% by mass to 5.0% by mass, and also contain Sn and Pd. The 5% compressive modulus (5% K value) is preferably in the range of 0.2 GPa to 3.5 GPa. The aforementioned resin composition is preferably selected from one or more of acrylic resins, styrene resins, polysiloxane resins, phenolic resins, urethane resins, and polyimide resins.

Images