Electroless ruthenium plating bath

Abstract

The object of the present invention is to provide an electroless ruthenium plating bath that uses a hydrazine as a reducing agent, and that can improve bath stability, has excellent ruthenium deposition properties, and can suppress film shrinkage during annealing treatment. The electroless ruthenium plating bath comprises at least a ruthenium compound, a reducing agent, and a stabilizer, wherein the reducing agent is a hydrazine, the stabilizer comprises a hydroxylamine compound and an organic compound having a hydroxyl group, the hydroxylamine compound is at least one of hydroxylamine sulfate and hydroxylamine chloride, and the organic compound having a hydroxyl group is at least one selected from the group consisting of gluconolactone, sorbitol, mannitol, and citric acid monohydrate.