Nano-twinned copper with (110) crystal plane orientation and its preparation method
The nano-bicrystalline copper with a (110) crystal plane orientation addresses the etching challenges of (111) orientation by enhancing etching rates, thereby reducing time and costs in integrated circuit manufacturing.
TW202632081APending Publication Date: 2026-08-01RUOYONG TECHNOLOGY CO LTD
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Patent Information
- Application Number
- TW114101989
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-01-17
- Publication Date
- 2026-08-01
- Estimated Expiration
- 2045-01-16
AI Technical Summary
Technical Problem
Nano-bicrystalline copper with a (111) crystal plane orientation is difficult to etch, leading to longer etching times and higher material costs, which is a challenge in integrated circuit manufacturing.
Method used
Developed a nano-bicrystalline copper with a (110) crystal plane orientation that features a specific nano-bicrystalline structure with angles between 30 to 90 degrees, allowing for higher etching rates and reduced etching process time and material costs.
Benefits of technology
The (110) crystal plane orientation exhibits an etching rate greater than 0.1 micrometers/minute, significantly reducing the overall cost of etching processes in integrated circuit manufacturing.
✦ Generated by Eureka AI based on patent content.
Abstract
This invention provides a nano-bicrystalline copper with a (110) crystal plane orientation, comprising a plurality of first grains and a plurality of second grains interconnected thereto; wherein each first grain comprises a plurality of first nano-bicrystalline structures stacked together along a preferred direction of the (110) crystal axis, and a plurality of first nano-bicrystalline interfaces are formed between these first nano-bicrystalline structures, the angle between these first nano-bicrystalline interfaces and the thickness direction of the nano-bicrystalline copper with the (110) crystal plane orientation being 30 degrees to 90 degrees; each second grain comprises a plurality of second nano-bicrystalline structures stacked together along a (111) crystal axis. The nano-bicrystalline copper with the (110) crystal plane orientation has a better etching rate, thereby reducing the overall cost of the etching process.
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