Electroplating apparatus and electroplating equipment

Abstract

This invention provides an electroplating apparatus and equipment for electroplating substrates. The electroplating apparatus is used to plate metal within a plurality of through-holes. The apparatus includes: a tank forming a chamber; and a substrate holder for holding the substrate vertically within the chamber during electroplating and dividing the chamber into a first plating chamber and a second plating chamber, the first and second plating chambers being used to contain electroplating solution. During the process of forming metal bridges within the plurality of through-holes, the first and second plating chambers are configured to contain electroplating solutions with different liquid levels, allowing the electroplating solution to flow from the plating chamber with the higher liquid level through the through-holes to the plating chamber with the lower liquid level. The electroplating apparatus provided in this application allows the electroplating solution to flow from the plating chamber with the higher liquid level through the through-holes to the plating chamber with the lower liquid level, enabling more metal ions to pass through the through-holes and thus forming metal bridges within the through-holes more quickly.

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