Lead wire arrangement structure and method for electroplating rack

Abstract

This invention relates to a conductive wire wiring structure and method for an electroplating rack. The structure includes a main frame that is insulating and corrosion-resistant. The main frame has at least one protruding support rod; at least one hook is attached to the support rod, and a workpiece to be plated is suspended from the hook; at least one conductive wire is correspondingly connected to the hook or the workpiece. The method includes connecting at least one conductive wire to a negative terminal of a power source; the conductive wire is connected in parallel to the workpiece; a current is output from a positive terminal of the power source, and this current passes through an electrolyte to electroplat the workpiece. The current passes through the conductive wire, forming an electroplating circuit. Because the main frame system is made of insulating material and is corrosion-resistant, its service life can be extended, significantly reducing the cost of replacing the electroplating rack.

Description

[Technical Field]

[0001] This invention relates to an electroplating wiring structure and wiring method that can significantly reduce the cost of replacing electroplating racks. [Previous Technology]

[0002] Currently, electroplating is mainly used to coat the surface of objects with metals or alloys, aiming to improve appearance, prevent corrosion, or increase wear resistance. The principle is to connect a DC power supply, with the electroplating metal connected to the positive terminal and the object to be plated connected to the negative terminal using an electroplating rack. When current is applied, the metal ions of the electroplating metal move to the surface of the object under the influence of the electric field and are reduced back to metal. Controlling the current density, temperature, and time ensures the uniformity and thickness of the coating on the surface of the object.

[0003] A common electroplating rack structure is exemplified by Patent No. M313680, "Electroplating Rack for Titanium Alloy," published on June 11, 2007 (Republic of China Year 96). It discloses that the rack comprises: a main frame with hooks formed on its top, made of copper or iron; a plurality of titanium alloy supports welded to the main frame, with hooks on their outer sides; and an insulating layer covering the welded main frame and titanium alloy supports. The insulating layer does not cover the hooks on the main frame or the titanium alloy supports. This provides an electroplating rack that can be used continuously in an electrolyte solution without being corroded or rusted by the electrolyte.

[0004] Due to the structure of the bracket in the prior art, both the main frame and the titanium alloy bracket are made of conductive metal, and then an insulating layer of plastic is wrapped around the outer edge. Since the bracket is immersed in a strong acid electrolyte for a long time, it is easily corroded and damaged, requiring frequent replacement of the bracket, resulting in a significant increase in usage costs.

[0005] Therefore, there is the utility model patent application CN221275935, "A High-Efficiency Electroplating Hanger," published on July 5, 2024, in mainland China. It discloses that: the main body is provided with several support frames, and a conductive hook and several insulating hooks are fixed on the support frames. The conductive hooks are electrically connected to wires, and the wires sequentially connect the conductive hooks and insulating hooks on the several support frames in series. Through the cooperation of the wires and conductive hooks, compared with the prior art, the waste caused by electroplating solution sticking to the outside of the hanger is avoided, thus having better practicality.

[0006] The method of use in the prior art patent mainly involves: "An insulating layer is provided on the outer side of both the main body and the support frame. The wire is electrically connected to the negative terminal of the power supply. First, the wire is wound around the conductive hook on the first layer of the support frame, and the workpiece to be electroplated is wound around the conductive hook with the wire. Then, the workpiece to be electroplated is wound around the remaining insulating hooks on the first layer of the support frame with the wire. After the first layer of the support frame is completed, the remaining wire is wound around the conductive hook on the second layer of the support frame, and the workpiece to be electroplated is wound around it at the same time. The above actions are repeated until the workpiece to be electroplated is wound around all the conductive hooks and insulating hooks." As can be seen from the above description, the prior art patent uses only a single wire to connect all the conductive hooks or workpieces to be electroplated in series, so as to perform electroplating by passing current. However, according to the calculation formula of the current required for electroplating:

[0007] I=J×A; where:

[0008] I: Total current (Amperes);

[0009] J: Current density (A / dm²);

[0010] A: Total surface area of ​​the object to be plated (dm²).

[0011] Currently, the wires used in electroplating with a cross-sectional area of ​​1 mm² can safely carry a current of 1.8A. Assuming that the minimum current required for electroplating the object is 200A, the required wire diameter is calculated as follows:

[0012] 200(A) / 1.8(mm2 / A)=111(mm2);

[0013] 111(mm2)=πr2; therefore, r2=35.3(mm2);

[0014] Therefore, the radius (r) of the wire is approximately 5.94 mm, and the diameter is approximately 12 mm.

[0015] Since the minimum current required for the previous patent case is 12mm in diameter, it is impossible to implement in practice, and its creative concept is actually not feasible. [Summary of the Invention]

[0016] Therefore, in view of the above-mentioned disadvantages of the electroplating racks currently used, the present invention provides a conductive wire wiring structure for an electroplating rack, comprising: a main frame body having insulation and corrosion resistance, the main frame body having at least one protruding rod; at least one hook portion connected to the rod, the hook portion suspending a workpiece to be plated; and at least one conductive wire correspondingly connected to the hook portion or the workpiece to be plated.

[0017] The above-mentioned main frame system is made of plastic, rubber or glass fiber.

[0018] The main frame system described above is integrally formed with the support rod protruding, or the support rod is welded to the main frame body.

[0019] The hook is integrally formed and attached to the support rod, or the hook is attached to the end of the support rod by welding.

[0020] The hook portion is insulating and corrosion resistant, or the hook portion is made of a conductive material.

[0021] The hook is made of plastic, rubber or glass fiber, and the conductive material is another metal material.

[0022] One end of the conductive wire is connected to a negative terminal of the power supply, and the other end of the conductive wire is provided with a clamp, which is clamped to the hook or the object to be plated.

[0023] The above-mentioned system has a plurality of support rods, a plurality of hooks, and a plurality of conductive wires, and one or more conductive wires are respectively connected to each hook or the object to be plated in parallel.

[0024] The present invention can also be a method for wiring conductive wires of an electroplating rack, comprising the following steps: setting up an insulated electroplating rack; suspending at least one object to be plated on the electroplating rack; connecting at least one conductive wire to a negative terminal of a power source; connecting the conductive wire to the object to be plated in parallel; outputting a current from a positive terminal of the power source, the current passing through an electrolyte to electroplat the object to be plated, the current passing through the conductive wire to form an electroplating circuit.

[0025] The present invention can also be a method for wiring conductive wires of an electroplating rack, comprising the following steps: providing an insulated electroplating rack; suspending a plurality of objects to be plated on the electroplating rack; providing a plurality of conductive wires, the conductive wires being connected to a negative terminal of a power source; one or more conductive wires being connected in parallel to each object to be plated; a current being output from a positive terminal of the power source, the current passing through an electrolyte to electroplat the objects to be plated, the current passing through the conductive wires to form an electroplating circuit.

[0026] The above-mentioned technical features have the following advantages:

[0027] 1. By using insulating materials to make the main frame system, it has excellent corrosion resistance. Even when immersed in strong acid electrolyte for a long time, it is not easily corroded or damaged, which can extend its service life and thus greatly save the cost of replacing electroplating racks.

[0028] 2. Even though the conductive wire is easily corroded and damaged, it still has the effect of reducing costs compared with the high-priced electroplating rack due to the extremely low cost of the conductive wire.

[0029] 3. One or more conductive wires are connected individually to each hook or object to be plated in parallel. Therefore, each conductive wire only needs a small diameter to safely carry the electroplating current for electroplating operations. Thus, it can be implemented without any disadvantage of not being able to implement it.

Implementation Method

[0030] Please refer to Figures 1, 2, and 3. The first embodiment of the present invention is a conductive wire wiring structure for an electroplating hanger. It includes: a main frame 1, a hook 2, and conductive wires 3, wherein:

[0031] The main frame 1 is made of an insulating material, possessing insulation properties and being a corrosion-resistant material, thus exhibiting excellent corrosion resistance. Therefore, the main frame 1 can be made of plastic, rubber, or fiberglass to facilitate recycling. At least one support rod 11 is integrally formed and protrudes from the periphery of the main frame 1, and the support rod 11 can also be welded to the main frame 1. The first embodiment of the present invention provides a plurality of such support rods 11.

[0032] At least one hook portion 2 is integrally formed and attached to the support rod 11. The hook portion 2 can also be welded to the end of the support rod 11. The hook portion 2 is made of the insulating material, has insulation properties, and has excellent corrosion resistance. Therefore, the hook portion 2 can be made of plastic, rubber, or fiberglass to facilitate recycling. In the first embodiment of the present invention, a plurality of hook portions 2 are provided. A plated object F is suspended on at least one hook portion 2, and even a single plated object F with a relatively large volume can be suspended on two or more hook portions 2 at the same time.

[0033] At least one conductive wire 3 is connected to the object to be plated F. One end of the conductive wire 3 is connected to the negative terminal of the power supply G, and the other end of the conductive wire 3 is provided with a clamp 31, which can be used to hold the object to be plated F. The clamp 31 is conductive so that the positive terminal of the power supply G outputs current to an electroplated metal [not shown in the figure]. The current passes through the electrolyte and then through the object to be plated F, the clamp 31, and the conductive wire 3 back to the negative terminal of the power supply G. In the first embodiment of the present invention, a plurality of conductive wires 3 are provided. One or more conductive wires 3 are respectively connected to each object to be plated F in parallel. Even for a single object to be plated that is relatively large, two or more conductive wires 3 can be connected to the object to be plated F in parallel [as shown in the fourth figure].

[0034] In use, as shown in Figures 1, 2, and 3, an appropriate number of objects to be plated, F, are suspended from the hooks 2 of the support rods 11 of the main frame 1. Then, the conductive lines 3 of the power supply G are connected in parallel and clamped to each corresponding object to be plated, F, by the clamps 31. That is, each object to be plated, F, can be assigned to at least one independent conductive line 3 for fixed connection. When electroplating begins, the power supply G is turned on, and the power supply G outputs current to the electroplating metal through its positive terminal. The metal ions of the electroplating metal can adhere to the surface of the object to be plated, F, through the electroplating solution, and the current returns to the negative terminal of the power supply G through the electrolyte, the clamps 31, and the conductive lines 3, thus forming an electroplating cycle until the electroplating operation is completed.

[0035] Thus, because the main frame 1 is made of insulating material and has excellent corrosion resistance, it is not easily corroded or damaged even when immersed in strong acid electrolyte for a long time, thereby extending its service life and significantly reducing the cost of replacing the electroplating rack. Even though the conductive wire 3 is susceptible to corrosion and damage, its extremely low cost still reduces costs compared to high-priced electroplating racks. Furthermore, each conductive wire 3 is individually connected to each object F to be plated in parallel, so each conductive wire 3 only needs to carry a small current to perform electroplating operations, making it extremely safe and feasible to use.

[0036] This invention has been tested in practice. It was found that there were 23 objects to be plated, and the minimum current required for electroplating was 200A. The current that a conductive wire with a cross-sectional area of ​​1mm² can safely carry is 1.8A. Therefore, for the same total surface area, the required diameter of the conductive wire is calculated as follows:

[0037] According to the formula for calculating the current required for electroplating: I=J×A.

[0038] 200(A) / 1.8(mm2 / A)=111(mm2);

[0039] 111(mm2) / 23(s)=4.83(mm2)

[0040] 4.83(mm2)=πr2; therefore, r2=1.54(mm2);

[0041] Therefore, the radius (r) of the conductive wire is approximately 1.24 mm, and the diameter is approximately 2.48 mm.

[0042] Therefore, the present invention uses a parallel electroplating method, requiring only a conductive wire diameter of less than 3 mm for implementation. Compared to the conventional electroplating rack (Chinese Patent No. CN221275935), under the same current and total surface area conditions, the conductive wire diameter (12 mm) required for the series connection in that Chinese patent is too thick and cannot be implemented. In contrast, the present invention uses a parallel connection method, requiring only a small conductive wire diameter (2.48 mm) for implementation, thus demonstrating a definite improvement in efficiency.

[0043] As shown in Figures 5, 6, and 7, the second embodiment of the present invention is a conductive wire wiring structure for an electroplating hanger. It includes: a main frame 4, a hook 5, and conductive wires 6, wherein:

[0044] The main frame 4 is made of an insulating and corrosion-resistant material, thus exhibiting excellent corrosion resistance. Therefore, the main frame 4 can be made of plastic, rubber, or fiberglass for easy recycling. At least one support rod 41 protrudes from the periphery of the main frame 4 by welding, and the support rod 11 can also be integrally formed and combined with the main frame 4. The second embodiment of the present invention provides a plurality of such support rods 11.

[0045] At least one hook portion 5 is integrally formed and attached to the support rod 41. The hook portion 5 may also be attached to the end of the support rod 41 by welding. The hook portion 5 is made of a conductive material and may be made of a metal material. In the second embodiment of the present invention, a plurality of hook portions 5 are provided, and a plated object F is suspended on at least one hook portion 2.

[0046] At least one conductive wire 6 is connected to the hook portion 5. One end of the conductive wire 6 is connected to the negative terminal of the power supply G, and the other end of the conductive wire 6 is provided with a clamp 61, which can be clamped to the hook portion 5. The clamp 61 is conductive so that the positive terminal of the power supply G outputs current to an electroplated metal [not shown in the figure]. The current passes through the electrolyte and then through the workpiece F to be plated, the clamp 61, the hook portion 5, and the conductive wire 6 back to the negative terminal of the power supply G. In the second embodiment of the present invention, a plurality of conductive wires 6 are provided, and one or more conductive wires 6 are respectively connected to each hook portion 5 in parallel. Even for a single workpiece F with a large volume, two or more conductive wires 6 can be connected to the hook portion 5 in parallel [as shown in Figure 8].

[0047] In use, as shown in Figures 5, 6, and 7, an appropriate number of objects F to be plated are suspended from the hooks 5 of the support rods 41 of the main frame 4. Then, the conductive wires 6 of the power supply G are connected in parallel and clamped to each corresponding hook 5 using their clamps 61. When electroplating begins, the power supply G is turned on, and the power supply G outputs current to the electroplating metal through its positive terminal. The metal ions of the electroplating metal can adhere to the surface of the object F through the electroplating solution with the current. The current then passes through the electrolyte and returns to the negative terminal of the power supply G through the object F, the hooks 5, the clamps 61, and the conductive wires 6, thus forming an electroplating cycle. In this way, the same effect can be achieved.

[0048] As shown in Figure 9, the third embodiment of the present invention is a method for wiring conductive lines of an electroplating hanger, comprising the following steps:

[0049] A. An insulated electroplating rack is provided. The structure of the electroplating rack is shown in Figures 1, 2 and 3, and it includes a main frame 1, a hook 2 and a conductive wire 3.

[0050] B. At least one object to be plated is suspended on the electroplating rack. The object to be plated, F, is suspended on the hook 2 of the support rod 11 of the main frame 1.

[0051] C. At least one conductive wire is connected to a negative terminal of a power source. One end of at least one conductive wire 3 is connected to a negative terminal of the power source G, and the other end of the conductive wire 3 is provided with a clamp 31.

[0052] D. The conductive wire is connected to the object to be plated in parallel. At least one conductive wire 3 of the power supply G is clamped to the corresponding object to be plated F by the clamp 31 in parallel.

[0053] E. A current is output from the positive terminal of the power supply. This current passes through an electrolyte to electroplate the object to be plated. The current passes through the conductive wire to form an electroplating circuit. The power supply G outputs current to an electroplating metal through its positive terminal. The metal ions of the electroplating metal can adhere to the surface of the object to be plated F through the electroplating solution along with the current. The current passes through the electrolyte and then through the object to be plated F, the fixture 31, and the conductive wire 3 back to the negative terminal of the power supply G to form an electroplating cycle.

[0054] Thus, since the main frame 1 is made of insulating material and has excellent corrosion resistance, it is not easily corroded or damaged even when immersed in strong acid electrolyte for a long time, and its service life can be extended, thus greatly saving the cost of replacing electroplating racks.

[0055] As shown in Figure 10, the fourth embodiment of the present invention is a method for wiring conductive lines of an electroplating hanger, comprising the following steps:

[0056] A1. An insulated electroplating rack is provided. The structure of the electroplating rack is shown in Figures 1, 2 and 3, and it includes a main frame 1, a hook 2 and a conductive wire 3.

[0057] B1. A plurality of objects to be plated are suspended on the electroplating rack. The objects to be plated F are suspended on the hooks 2 of the support rods 11 of the main frame 1.

[0058] C1. A plurality of conductive lines are provided, which are connected to a negative terminal of a power source. One end of each of the conductive lines 3 is connected to a negative terminal of the power source G, and the other end of each of the conductive lines 3 is provided with a clamp 31.

[0059] D1. One or more conductive lines are connected in parallel to each of the objects to be plated. The conductive lines 3 of the power supply G are connected in parallel and clamped to the corresponding objects to be plated F by the clamps 31.

[0060] E1. A current is output from the positive terminal of the power supply. This current passes through an electrolyte to electroplate the objects to be plated. The current passes through the conductive wires to form an electroplating circuit. The power supply G outputs current to an electroplating metal through its positive terminal. The metal ions of the electroplating metal can adhere to the surface of the objects to be plated F through the electroplating solution with the current. The current passes through the electrolyte and then returns to the negative terminal of the power supply G through the objects to be plated F, the clamps 31, and the conductive wires 3 to form an electroplating cycle.

[0061] Thus, since the main frame 1 is made of insulating material and has excellent corrosion resistance, it is not easily corroded or damaged even when immersed in strong acid electrolyte for a long time, and its service life can be extended, thus greatly saving the cost of replacing electroplating racks.

[0062] Based on the above description of the embodiments, the operation, use and effects of the present invention can be fully understood. However, the above embodiments are only preferred embodiments of the present invention and should not be used to limit the scope of the present invention. Simple equivalent changes and modifications made in accordance with the scope of the patent application and the description of the invention are all within the scope of the present invention. [Simplified Explanation of the Diagram]

[0063] [Figure 1] is a perspective view of the first embodiment of the present invention.

[0064] [Figure 2] is a schematic diagram of the wiring structure of the first embodiment of the present invention.

[0065] [Figure 3] is a schematic diagram of the clamp holding the object to be plated according to the first embodiment of the present invention.

[0066] [Figure 4] is a schematic diagram of two conductive lines connected in parallel to the plated object in the first embodiment of the present invention.

[0067] [Figure 5] is a perspective view of the second embodiment of the present invention.

[0068] [Figure 6] is a schematic diagram of the wiring structure of the second embodiment of the present invention.

[0069] [Figure 7] is a schematic diagram of the clamp holding the hook in the second embodiment of the present invention.

[0070] [Figure 8] is a schematic diagram of two conductive wires connected in parallel to the hook in the second embodiment of the present invention.

[0071] [Figure 9] is an operation flowchart of the wiring method of the third embodiment of the present invention.

[0072] [Figure 10] is an operation flowchart of the wiring method of the fourth embodiment of the present invention.

Claims

1. A conductive wire wiring structure for an electroplating rack, comprising: a main frame having insulation and corrosion resistance, the main frame having a plurality of protruding support rods; a plurality of hooks connected to the support rods, the hooks having a workpiece to be plated suspended from them; and a plurality of conductive wires, one or more of the conductive wires being connected in parallel to each hook or the workpiece to be plated.

2. The conductive wire wiring structure of the electroplating rack as described in claim 1, wherein, The main frame system is made of plastic, rubber, or fiberglass.

3. The conductive wire wiring structure of the electroplating rack as described in claim 1, wherein, The main frame system is integrally formed with the support rod protruding, or the support rod is welded to the main frame body.

4. The conductive wire wiring structure of the electroplating rack as described in claim 1, wherein, The hook is integrally formed and attached to the support rod, or the hook is welded to the end of the support rod.

5. The conductive wire wiring structure of the electroplating rack as described in claim 1, wherein, The hook is insulating and corrosion resistant, or the hook is made of a conductive material.

6. The conductive wire wiring structure of the electroplating rack as described in claim 5, wherein, The hook is made of plastic, rubber, or fiberglass, and the conductive material is another metal material.

7. The conductive wire wiring structure of the electroplating rack as described in claim 1, wherein, One end of the conductive wire is connected to the negative terminal of the power supply, and the other end of the conductive wire is provided with a clamp that is clamped to the hook or the object to be plated.

8. A method for wiring conductive wires in an electroplating rack, comprising the following steps: providing an insulated electroplating rack; suspending at least one object to be plated on the electroplating rack; connecting at least one conductive wire to a negative terminal of a power source; connecting the conductive wire to the object to be plated in parallel; outputting a current from a positive terminal of the power source, the current passing through an electrolyte to electroplat the object, the current passing through the conductive wire to form an electroplating circuit.

9. A method for wiring conductive wires in an electroplating rack, comprising the following steps: providing an insulated electroplating rack; suspending a plurality of objects to be plated on the electroplating rack; providing a plurality of conductive wires connected to a negative terminal of a power source; connecting one or more conductive wires in parallel to each object to be plated; outputting a current from a positive terminal of the power source, the current passing through an electrolyte to electroplat the objects, the current passing through the conductive wires to form an electroplating circuit.

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