Control methods and plating equipment

Abstract

In a plating apparatus having a plurality of plating modules, it is required to form a high-quality coating by using appropriate plating modules for plating processing. This invention provides a control method for a plating apparatus having a plurality of plating modules, comprising the following steps: obtaining coating thickness measurement data for a plurality of substrates after plating processing by the plurality of plating modules; determining the quality of each plating module based on the coating thickness measurement data; and controlling the plating process in the plating apparatus based on the quality of each plating module.

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