Control methods and plating equipment

The control method for a plating apparatus with multiple modules addresses the challenge of high-cost substrate processing by measuring and optimizing module quality, ensuring high-quality coatings and reducing defects for efficient operation.

TW202632085APending Publication Date: 2026-08-01EBARA CORP
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Patent Information

Application Number
TW114135409
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-09-27
Filing Date
2025-09-16
Publication Date
2026-08-01

AI Technical Summary

Technical Problem

In semiconductor manufacturing, the increasing cost and complexity of substrates require high-performance processing, and equipment malfunctions lead to significant losses, especially when expensive substrates are involved.

Method used

A control method for a plating apparatus with multiple modules that involves measuring coating thickness, determining module quality based on this data, and controlling the process to ensure high-quality coatings using appropriate modules.

Benefits of technology

This approach ensures high-quality coatings are formed, reduces process defects, and enhances the efficient operation of the plating apparatus by utilizing the appropriate quality modules for each substrate.

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Abstract

In a plating apparatus having a plurality of plating modules, it is required to form a high-quality coating by using appropriate plating modules for plating processing. This invention provides a control method for a plating apparatus having a plurality of plating modules, comprising the following steps: obtaining coating thickness measurement data for a plurality of substrates after plating processing by the plurality of plating modules; determining the quality of each plating module based on the coating thickness measurement data; and controlling the plating process in the plating apparatus based on the quality of each plating module.
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