Electroplating equipment

Abstract

This application provides an electroplating apparatus, including an electroplating chamber and a metal unit. The metal unit is placed in the anode chamber of the electroplating chamber, which contains an electroplating solution containing ions of the metal corresponding to the metal unit. An inert electrode is disposed within the electroplating chamber and configured to be electrically connected to the metal unit during non-plating periods to form a circuit. In this circuit, the inert electrode acts as the anode, and the metal unit acts as the cathode. A preset voltage is applied between the inert electrode and the metal unit, which is lower than the threshold voltage at which the metal unit undergoes an electrochemical reaction during non-plating periods. In the electroplating apparatus of this application, during non-plating periods, the inert electrode acts as the anode, the metal unit acts as the cathode, and the voltage applied between the inert electrode and the metal unit is lower than the threshold voltage at which the metal unit undergoes an electrochemical reaction during non-plating periods, resulting in the metal unit being in a weak cathodic polarization state and suppressing the self-dissolution of the metal unit in the electroplating solution.

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