Semiconductor processing systems configured for performing plasma enhanced chemical vapor deposition processes and methods for depositing epitaxial layer on substrate
TW202632090APending Publication Date: 2026-08-01ASM IP HLDG BV
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Patent Information
- Application Number
- TW114137167
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-09-30
- Filing Date
- 2025-09-26
- Publication Date
- 2026-08-01
Abstract
Semiconductor processing systems for depositing an epitaxial layer on a substrate by a plasma enhanced chemical vapor deposition are disclosed. The semiconductor processing system includes a chamber body, a substrate support arranged within the chamber interior, and a plasma generation means configured for generating a reactive species within the chamber interior. Methods for depositing an epitaxial layer on a substrate by a plasma enhanced chemical vapor deposition process are also disclosed.
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