Semiconductor processing systems configured for performing plasma enhanced chemical vapor deposition processes and methods for depositing epitaxial layer on substrate

TW202632090APending Publication Date: 2026-08-01ASM IP HLDG BV
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Patent Information

Application Number
TW114137167
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-09-30
Filing Date
2025-09-26
Publication Date
2026-08-01
Patent Text Reader

Abstract

Semiconductor processing systems for depositing an epitaxial layer on a substrate by a plasma enhanced chemical vapor deposition are disclosed. The semiconductor processing system includes a chamber body, a substrate support arranged within the chamber interior, and a plasma generation means configured for generating a reactive species within the chamber interior. Methods for depositing an epitaxial layer on a substrate by a plasma enhanced chemical vapor deposition process are also disclosed.
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