Integrated liquid cooling radiator with heat pipe

Abstract

This invention discloses an integrated heat pipe liquid cooling radiator, comprising a liquid cooling radiator, a liquid pump, a liquid cooling head, and multiple heat pipes. The liquid cooling radiator has upper and lower liquid boxes and a heat dissipation pipe assembly. The liquid pump is located in the liquid cooling radiator, driving the coolant in the radiator to circulate and dissipate heat. The liquid cooling head is located below one of the liquid boxes of the liquid cooling radiator, and its bottom surface has multiple heat pipe grooves. The two ends of the heat pipes form closed heat dissipation sections, which extend into the second liquid box respectively. The heat-absorbing sections in the middle of the heat pipes are embedded in the heat pipe grooves of the liquid cooling head, and a heat source contact surface is machined therein. When in use, this invention allows the working fluid in the heat pipes to exchange heat with the processor in the heat-absorbing sections, raising its temperature. The heated working fluid flows to the heat dissipation sections at both ends, where it exchanges heat with the coolant in the liquid cooling radiator, thus achieving efficient heat transfer and heat dissipation.

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