Heat dissipation device

Abstract

This invention provides a heat sink with excellent heat dissipation in its base portion, excellent flexibility in the arrangement of heat-conducting components, and the ability to design heat dissipation fins to an optimal thickness. The heat sink comprises: a base portion having a first surface and a second surface facing the first surface, with a heat-generating element thermally connected to the second surface; and heat dissipation fins erected on the first surface of the base portion. The heat sink is a heat sink in which the base portion and the heat dissipation fins are independent entities, and at least a portion of the heat-conducting components is embedded within the heat sink. none

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