Flow channel structure

Abstract

The invention relates to a flow channel structure. The flow channel structure comprises a substrate, the substrate is provided with a fluid passage and a heat insulating cavity. The fluid passage is provided for the flow of the heat insulating medium, and the number of the fluid passages is set to at least two, the interval between any two adjacent fluid passages in at least two fluid passages is set, and the heat insulating cavity is provided between any adjacent two fluid passages in at least two fluid passages. A heat insulating medium is provided in the heat insulating cavity and is configured to prevent the heat exchange of the heat insulating medium in two adjacent fluid passages of the heat insulating cavity.

Description

[Technical Field]

[0001] This application relates to the field of heat exchange technology, and more specifically, to flow channel structures. [Previous Technology]

[0002] The different heat dissipation pipes in the heat dissipation device are mostly laid out independently and fixed by their respective mounting brackets, resulting in the entire heat dissipation device occupying a large space and the heat dissipation device having low disassembly and assembly efficiency. [Summary of the Invention]

[0003] This application provides a flow channel structure to solve the problem that heat dissipation devices occupy a large space and have low disassembly and assembly efficiency in the known technology.

[0004] The embodiments of this application are implemented as follows:

[0005] A flow channel structure includes a substrate, on which a fluid channel and a heat insulation cavity are provided; wherein, the fluid channel is for the flow of a heat-conducting medium, and the number of the fluid channels is set to at least two, any two adjacent fluid channels are spaced apart, and the heat insulation cavity is provided between any two adjacent fluid channels; the heat insulation cavity is provided with a heat insulation medium, and the heat insulation medium is configured to prevent heat exchange between the heat-conducting medium in the two adjacent fluid channels in the heat insulation cavity.

[0006] In one possible implementation: the extension direction of the fluid channel is parallel to the first direction, the at least two fluid channels include a first flow channel and a second flow channel, along the second direction, the first flow channel and the second flow channel are spaced apart, and the second direction intersects the first direction; wherein, the heat insulation cavity is provided between the first flow channel and the second flow channel, and the heat insulation cavity is spaced apart from the first flow channel and the second flow channel.

[0007] In one possible implementation: along the first direction, the extension length of the heat insulation cavity is greater than or equal to the extension length of the first flow channel and the extension length of the second flow channel.

[0008] In one possible implementation: along a third direction, at least one side of the substrate has an opening, the third direction intersects with the first direction and the second direction, the opening communicates with the heat insulation cavity to divide the substrate into a first region and a second region, the first flow channel is disposed on the first region, and the second flow channel is disposed on the second region.

[0009] In one possible implementation: along the first direction, the width of the opening is less than the extension length of the heat insulation cavity, so as to form a connection between the first region and the second region, the connection being integrally formed with the first region and the second region.

[0010] In one possible implementation: the flow channel structure further includes a reserved portion, which is connected to one side of the substrate along a third direction. The reserved portion is provided with a third flow channel, which communicates with one of the fluid channels. The reserved portion is also provided with an inlet and outlet, which communicate with the third flow channel.

[0011] In one possible implementation: the reserved portion is integrally formed with the substrate.

[0012] In one possible implementation: the at least two fluid channels include a first flow channel and a second flow channel, the third flow channel is inclined to the first flow channel and communicates with the first flow channel, and the third flow channel is at least partially located on the side of the second flow channel that is upward towards the reserved portion.

[0013] In one possible implementation: along the third direction, the heat insulation cavity is provided between the third flow channel and the second flow channel, and the heat insulation medium is provided in the heat insulation cavity.

[0014] In one possible implementation: the at least two fluid channels include a first flow channel, a second flow channel, and a fourth flow channel; along a second direction, the first flow channel and the second flow channel are spaced apart, and the heat insulation cavity is provided between the first flow channel and the second flow channel; along a third direction, the fourth flow channel is spaced apart on one side of the first flow channel and the second flow channel, and the heat insulation cavity is provided between the fourth flow channel and the first flow channel and the second flow channel.

[0015] In the flow channel structure of this application, at least two fluid channels are provided on the substrate, each of which allows the flow of a heat-conducting medium. This enables the flow channel structure to have multiple different flow channels, thereby achieving simultaneous heat dissipation for multiple heat-dissipating components or constructing a circulating heat dissipation loop between different components. Each fluid channel is located on the substrate, achieving integrated configuration of each fluid channel. This not only reduces the space occupied by the flow channel structure but also allows the entire flow channel structure to be installed after only the substrate is mounted, greatly improving the assembly and disassembly efficiency of the flow channel structure. Furthermore, a heat insulation cavity is provided between any two adjacent fluid channels, and a heat insulation medium is provided in the heat insulation cavity to form a heat insulation layer between the two adjacent fluid channels, preventing heat exchange between the heat-conducting media in the two adjacent fluid channels from affecting their respective heat exchange effects.

Implementation Method

[0016] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0017] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. When a component is said to be "set on" another component, it can be directly set on the other component or there may be an intervening component. The terms "left," "right," and similar expressions used herein are for illustrative purposes only.

[0018] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "or / and" as used herein includes any and all combinations of one or more of the associated listed items.

[0019] Some embodiments of this application are described in detail. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0020] As shown in Figures 1 to 3, this embodiment provides a flow channel structure 100, including a substrate 10, on which a fluid channel 20 and a heat insulation cavity 30 are provided. The fluid channel 20 is for the flow of a heat-conducting medium, which can be a liquid such as a coolant that can exchange heat with a heat-generating element, so that the heat generated by the heat-conducting element is carried away by the heat-conducting medium as it flows through the heat-generating element. The number of fluid channels 20 is set to at least two, with any two adjacent fluid channels 20 spaced apart, and a heat insulation cavity 30 is provided between any two adjacent fluid channels 20. A heat insulation medium is provided inside the heat insulation cavity 30, and the heat insulation medium is configured to prevent heat exchange between the heat-conducting medium in the adjacent two fluid channels 20 of the heat insulation cavity 30. The heat insulation medium can be any gas, such as air, thereby forming an air gap between the two adjacent fluid channels 20. Air has poor thermal conductivity, thus preventing heat exchange between the heat-conducting medium in the two adjacent fluid channels 20 due to temperature differences.

[0021] Thus, the flow channel structure 100 of this application, by providing at least two fluid channels 20 on the substrate 10, each fluid channel 20 can be used for the flow of heat-conducting medium, so that the flow channel structure 100 can have multiple different flow channels to achieve simultaneous heat dissipation of multiple heat-dissipating components or to construct a circulating heat dissipation loop between different components. Each fluid channel 20 is provided on the substrate 10, realizing the integrated arrangement of each fluid channel 20, which not only reduces the space occupied by the flow channel structure 100, but also allows the entire flow channel structure 100 to be installed after only the substrate 10 is installed, greatly improving the disassembly and assembly efficiency of the flow channel structure 100. In addition, a heat insulation cavity 30 is provided between any two adjacent fluid channels 20, and a heat insulation medium is provided in the heat insulation cavity 30 to form a heat insulation layer between the two adjacent fluid channels 20, avoiding heat exchange of the heat-conducting medium in the two adjacent fluid channels 20 and affecting their respective heat exchange effects.

[0022] Referring again to Figures 1 to 3, in one embodiment, the substrate 10 is generally a long strip structure with a rectangular cross-section. The substrate 10 can be made of materials such as aluminum, and can be manufactured by extrusion molding. The specific material and molding process of the substrate 10 can be adapted to meet actual design requirements.

[0023] For ease of subsequent reading, this application introduces a first direction X, a second direction Z, and a third direction Y to describe the embodiments of this application. The first direction X, the second direction Z, and the third direction Y can be three non-parallel straight lines in space; further, the first direction X, the second direction Z, and the third direction Y can be three mutually perpendicular directions in a three-dimensional coordinate system (a three-dimensional Cartesian coordinate system). In subsequent embodiments, the first direction X is described as the X-axis direction of the coordinate axis of the three-dimensional coordinate system, the second direction Z is the Z-axis direction of the coordinate axis of the three-dimensional coordinate system, and the third direction Y is the Y-axis direction of the coordinate axis of the three-dimensional coordinate system. For example, the first direction X is the length direction of the substrate 10, the second direction Z is the height direction of the substrate 10, and the third direction Y is the width direction of the substrate 10.

[0024] Further, the extension direction of the fluid channel 20 is parallel to the first direction X. Along the first direction X, the fluid channel 20 extends through from one end face of the substrate 10 to the other end face of the substrate 10, so as to realize the connection of the fluid channels 20 of different substrates 10 by splicing different substrates 10.

[0025] In this embodiment, the number of fluid channels 20 is set to two. The two fluid channels 20 include a first flow channel 21 and a second flow channel 22. The extension direction of the first flow channel 21 and the extension direction of the second flow channel 22 are both parallel to the first direction X. Along the first direction X, the first flow channel 21 and the second flow channel 22 extend through the end face of one end of the substrate 10 to the end face of the other end of the substrate 10. The flow direction of the heat-conducting medium in the first flow channel 21 and the flow direction of the heat-conducting medium in the second flow channel 22 can be the same as or opposite to that of the heat-conducting medium. The cross-sectional shape of the first flow channel 21 and the second flow channel 22 is rectangular.

[0026] It is understood that in other embodiments, the cross-sectional shapes of the first flow channel 21 and the second flow channel 22 may be different, and the cross-sectional shapes of the first flow channel 21 and the second flow channel 22 may be regular shapes such as curved or serpentine or irregular shapes. The cross-sectional shapes of the first flow channel 21 and the second flow channel 22 may be adaptively selected according to actual design requirements, and are not specifically limited in this application.

[0027] Along the second direction Z, the first flow channel 21 and the second flow channel 22 are spaced apart, and the heat insulation cavity 30 is disposed between the first flow channel 21 and the second flow channel 22, and is spaced apart from the first flow channel 21 and the second flow channel 22, so that the first flow channel 21, the second flow channel 22, and the heat insulation cavity 30 are three independently disposed cavities on the substrate 10. The first flow channel 21, the second flow channel 22, and the heat insulation cavity 30 can be directly processed during the processing of the substrate 10 by the extrusion molding process, which improves the processing efficiency. In addition, the first flow channel 21, the second flow channel 22, and the heat insulation cavity 30 are disposed on the same substrate 10, which can realize the integrated design of the first flow channel 21, the second flow channel 22, and the heat insulation cavity 30. Compared with the structure in which the three are disposed on different plates, the flow channel structure 100 can be more compact and the volume of the entire flow channel structure 100 can be reduced.

[0028] It is understood that in other embodiments, the number of fluid channels 20 may also be three or four, or other numbers. Along the second direction Z, multiple fluid channels 20 are arranged sequentially at intervals, and a heat insulation cavity 30 is provided between any two adjacent fluid channels 20. In this application, the number of fluid channels 20 is not specifically limited, and its number can be selected according to actual design requirements.

[0029] Along the first direction X, the extension length of the heat insulation cavity 30 is greater than or equal to the extension length of the first flow channel 21, and the extension length of the heat insulation cavity 30 is greater than or equal to the extension length of the second flow channel 22, so that the gas interlayer formed by the gas in the heat insulation cavity 30 can cover the area between the first flow channel 21 and the second flow channel 22 as much as possible, thereby improving the heat insulation effect between the heat-conducting medium in the first flow channel 21 and the heat-conducting medium in the second flow channel 22.

[0030] Referring again to Figures 1 to 3, in one embodiment, an opening 13 is provided on at least one side of the substrate 10 along the third direction Y. The opening 13 connects to the heat insulation cavity 30 to divide the substrate 10 into a first region 11 and a second region 12. A first flow channel 21 is provided on the first region 11, and a second flow channel 22 is provided on the second region 12.

[0031] Specifically, openings 13 are machined on one or both sides of the substrate 10 along the third direction Y using cutting or other processing techniques. The openings 13 extend inward from the sidewall of the substrate 10 along the third direction Y to connect to the heat insulation cavity 30. The openings 13 increase the volume of the heat insulation cavity 30, thereby increasing the volume of the air jacket and further improving the heat insulation effect of the air jacket on the heat-conducting medium in the first flow channel 21 and the second flow channel 22. Furthermore, the openings 13 also reduce the weight of the substrate 10.

[0032] In this embodiment, along the second direction Z, the width of the opening 13 is less than the distance between the first flow channel 21 and the second flow channel 22, so as to avoid the processed opening 13 from communicating with the first flow channel 21 or the second flow channel 22.

[0033] Along the first direction X, the width of the opening 13 is less than the extension length of the heat insulation cavity 30, so as to form a connecting portion 14 between the first section 11 and the second section 12. The connecting portion 14 is integrally formed with the first section 11 and the second section 12. That is, after the opening 13 is cut out, the connecting portion 14 is still retained between the first section 11 and the second section 12, thereby ensuring the stability of the connection between the first section 11 and the second section 12. In addition, the setting of the opening 13 forms an independently distributed connecting portion 14 between the first section 11 and the second section 12, which can reduce the contact area between the first section 11 and the second section 12, reduce the heat exchange between the first section 11 and the second section 12, thereby reducing the heat exchange between the heat-conducting medium in the first flow channel 21 opened in the first section 11 and the heat-conducting medium in the second flow channel 22 opened in the second section 12, and ensuring that the heat-conducting media in the first flow channel 21 and the second flow channel 22 operate stably.

[0034] Along the third direction Y, the number of openings 13 on the same side of the substrate 10 is set to two. Along the first direction X, the two openings 13 are spaced apart to form three connecting portions 14. Along the first direction X, the two outermost connecting portions 14 are located at both ends of the substrate 10, and the middle connecting portion 14 is located at the middle position of the substrate 10, so as to achieve a uniform distribution of the three connecting portions 14, thereby improving the structural strength of the entire substrate 10.

[0035] It is understood that in other embodiments, along the third direction Y, the number of openings 13 on the same side of the substrate 10 can be set to three or four, and the specific number can be selected according to actual design requirements.

[0036] Referring again to Figures 1 to 3, in one embodiment, the flow channel structure 100 further includes a reserved portion 40, which is connected to one side of the substrate 10 along the third direction Y. The reserved portion 40 is provided with a third flow channel 41, which is connected to a fluid channel 20. The reserved portion 40 is also provided with an inlet and outlet 42, which are connected to the third flow channel 41.

[0037] In this embodiment, along the third direction Y, the opening 13 is provided on one side of the substrate 10, and the reserved portion 40 is connected to the other side of the substrate 10. The reserved portion 40 is integrally formed with the substrate 10, so as to facilitate the direct processing of the substrate 10 and the reserved portion 40, thereby improving processing efficiency.

[0038] Along the second direction Z, the top surface of the substrate 10 is designated as a first thermally conductive surface P1, and the bottom surface of the substrate 10 is designated as a second thermally conductive surface P2. The heat-generating component can contact the first thermally conductive surface P1 through thermally conductive structures such as heat dissipation fins, thereby allowing the heat generated by the heat-generating component to be carried away by the thermally conductive medium flowing within the first flow channel 21. Furthermore, other heat-generating components can also contact the second thermally conductive surface P2 through thermally conductive structures such as heat dissipation fins, thereby allowing the heat generated by the heat-generating component to be carried away by the thermally conductive medium flowing within the second flow channel 22.

[0039] For example, a snap-fit ​​groove 15 is formed on the surface of the substrate 10, and the heat dissipation fins can be snapped into the snap-fit ​​groove 15 so that the heat dissipation fins are fixed relative to the substrate 10. In addition, the heat dissipation fins contact the groove wall of the snap-fit ​​groove 15 to achieve thermal coupling between the heat dissipation fins and the substrate 10.

[0040] Along the third direction Y, the surface of the reserved portion 40 on the side away from the substrate 10 is designated as the third heat-conducting surface P3. The third flow channel 41 is inclined to the first flow channel 21 and is connected to the first flow channel 21. The cross-sectional shape of the flow channel formed after the third flow channel 41 is connected to the first flow channel 21 is approximately "L" shaped, so that the heat-conducting medium in the first flow channel 21 can flow into the third flow channel 41, and the heat-generating component can contact the third heat-conducting surface P3 through heat-conducting structures such as heat dissipation fins. In this way, the heat generated by the heat-generating component can be carried away by the heat-conducting medium flowing in the third flow channel 41, thereby increasing the heat dissipation surface of the flow channel structure 100. This makes the flow channel structure 100 applicable to heat-generating components in different positions, without the need to adjust the structure of the flow channel structure 100 itself due to the different positions of the heat-generating components.

[0041] In addition, along the third direction Y, the inlet and outlet 42 are opened on the surface of the reserved part 40 away from the substrate 10. After the pipe is connected from the right side of the substrate 10, the heat-conducting medium is injected into the third flow channel 41. The heat-conducting medium then flows into the first flow channel 21 connected to it, thereby realizing the lateral injection of the heat-conducting medium in the first flow channel 21, further improving the applicability of the flow channel structure 100.

[0042] In this embodiment, the extension length of the reserved portion 40 along the first direction X is less than the extension length of the substrate 10. The reserved portion 40 is integrally formed on the sidewall of the end of the substrate 10 along the first direction X, and the end face of the reserved portion 40 at one end along the first direction X is coplanar with the end face of the substrate 10 at one end along the first direction X, so that the inlet / outlet 42 is approximately located at the end of the substrate 10, facilitating pipe connection. A third flow channel 41 is formed on the end face of the front end of the reserved portion 40 along the first direction X, and the extension direction of the third flow channel 41 is parallel to the first direction X.

[0043] It is understood that in other embodiments, the reserved portion 40 may also be provided at other locations such as the middle position of the side wall of the substrate 10. Alternatively, the extension length of the reserved portion 40 in the first direction X is the same as the extension length of the substrate 10. In this application, the specific location and structure of the reserved portion 40 can be adaptively selected according to actual design requirements.

[0044] It is understood that in other embodiments, a liquid injection port may also be opened on the top surface of the substrate 10, and the liquid injection port is connected to the first flow channel 21, so that a heat-conducting medium can be injected into the first flow channel 21 after the pipe is connected from the upper side of the substrate 10.

[0045] A first connecting port 16 and a second connecting port 17 are provided on the bottom end surface of the substrate 10. Both the first connecting port 16 and the second connecting port 17 are connected to the second flow channel 22. The heat-conducting medium can be injected into the second flow channel 22 from one of the first connecting port 16 and the second connecting port 17, and the heat-conducting medium will then carry away the heat of the heat-generating element in contact with the second heat-conducting surface P2. Subsequently, the heat-conducting medium flows out of the second flow channel 22 from the other of the first connecting port 16 and the second connecting port 17.

[0046] Referring again to Figures 1 to 3, in one embodiment, the third flow channel 41 is at least partially located on the side of the second flow channel 22 in the third direction Y near the reserved portion 40, that is, along the second direction Z. The extension length of the third flow channel 41 is greater than the extension length of the first flow channel 21, so that the third flow channel 41 can extend along the second direction Z to near the bottom end face of the reserved portion 40, thereby increasing the projection of the third flow channel 41 on the third heat-conducting surface P3 in the third direction Y, and improving the heat dissipation efficiency of the heat-conducting medium in the third flow channel 41 on the heat-generating component mounted on the third heat-conducting surface P3.

[0047] Further, along the third direction Y, a heat insulation cavity 30 is provided between the third flow channel 41 and the second flow channel 22. The heat insulation cavity 30 is provided with a heat insulation medium to avoid heat exchange between the heat-conducting medium in the section of the third flow channel 41 located on the right side of the second flow channel 22 and the heat-conducting medium in the second flow channel 22, thereby affecting the heat exchange effect of the heat-conducting medium in the second flow channel 22.

[0048] Referring again to Figure 4 and Figure 1, in one embodiment, the third flow channel 41 can also be connected to the second flow channel 22, that is, the third flow channel 41 and the second flow channel 22 form an "L"-shaped flow channel after being connected, so that the heat-conducting medium in the second flow channel 22 can flow into the third flow channel 41, and thus the heat-conducting medium in the second flow channel 22 can act on the third heat-conducting surface P3. In addition, the specific extension direction and shape of the third flow channel 41 can also be adaptively selected according to the actual design requirements.

[0049] Referring again to Figure 5 and Figure 1, in one embodiment, at least two fluid channels 20 include a first flow channel 21, a second flow channel 22, and a fourth flow channel 23.

[0050] Along the second direction Z, the first flow channel 21 and the second flow channel 22 are spaced apart, and a heat insulation cavity 30 is provided between the first flow channel 21 and the second flow channel 22. Along the third direction Y, the fourth flow channel 23 is spaced apart on one side of the first flow channel 21 and the second flow channel 22, and a heat insulation cavity 30 is provided between the fourth flow channel 23 and the first flow channel 21 and the second flow channel 22.

[0051] Referring again to Figure 6 and Figure 1, in one embodiment, at least two fluid channels 20 include a first flow channel 21, a second flow channel 22, a fifth flow channel 24, and a sixth flow channel 25. Along the second direction Z, the first flow channel 21, the fifth flow channel 24, the sixth flow channel 25, and the second flow channel 22 are arranged at intervals in sequence, and a heat insulation cavity 30 is provided between the first flow channel 21 and the fifth flow channel 24, between the fifth flow channel 24 and the sixth flow channel 25, and between the sixth flow channel 25 and the second flow channel 22, so as to ensure the heat insulation effect between each flow channel.

[0052] Along the third direction Y, a reserved portion 40 is integrally formed on the right side of the substrate 10, and two third flow channels 41 are provided on the reserved portion 40. The two third flow channels 41 are respectively connected to the fifth flow channel 24 and the sixth flow channel 25, and along the second direction Z, the two third flow channels 41 extend in opposite directions, so that the fifth flow channel 24 and the sixth flow channel 25 located in the middle position can be connected to the external pipeline after opening the surface of the reserved portion 40 away from the substrate 10. The first flow channel 21 and the second flow channel 22 located on the upper and lower sides can be connected to the external pipeline after opening the end face of the upper and lower ends of the substrate 10. In this way, when multiple flow channels are provided in the flow channel structure 100, pipes can be connected from each side of the flow channel structure 100 to connect different flow channels, so as to avoid the interface of multiple flow channels being too concentrated, which would be inconvenient for the installation of the flow channel structure 100, and improve the disassembly and assembly efficiency of the flow channel structure 100. Furthermore, the interfaces of the flow channel structure 100 are distributed on each surface of the substrate 10 and the reserved portion 40, which can reasonably allocate the position of the interfaces and avoid the flow channel structure 100 occupying too much space on one side due to too many interfaces.

[0053] Referring again to Figures 7 and 8, in one embodiment, the cross-sectional shape of the first flow channel 21 and the second flow channel 22 can be a "U" shape or other shapes in addition to the rectangle mentioned above.

[0054] Specifically, the cross-sectional shape of the first flow channel 21 is approximately "U" shaped, and the shape of the heat insulation cavity 30 is adapted to the shape of the first flow channel 21. The heat insulation cavity 30 is arranged at intervals around the outer periphery of the first flow channel 21. The second flow channel 22 is arranged at intervals on the side of the heat insulation cavity 30 away from the first flow channel 21. The shape of the second flow channel 22 is adapted to the shape of the first flow channel 21, and the second flow channel 22 is arranged around the outer periphery of the heat insulation cavity 30 to ensure that there is an air gap formed by the heat insulation cavity 30 between each section of the first flow channel 21 and the second flow channel 22, thereby ensuring the heat insulation between the first flow channel 21 and the second flow channel 22.

[0055] Furthermore, an extension channel 50 is also formed on the substrate 10. The extension channel 50 is located on the side of the first channel 21 away from the second channel 22, and the extension channel 50 is connected to the first channel 21. A third connecting port 51 and a fourth connecting port 52 are also formed on the substrate 10. Both the third connecting port 51 and the fourth connecting port 52 are connected to the extension channel 50, and the third connecting port 51 and the fourth connecting port 52 are located on different side walls of the substrate 10, so as to realize that the docking pipe can be connected to the extension channel 50 from different sides of the substrate 10.

[0056] A fifth communication port 53 is also provided on the substrate 10. The fifth communication port 53 is located on the side of the second flow channel 22 away from the first flow channel 21, and the fifth communication port 53 is connected to the second flow channel 22.

[0057] Further, the substrate 10 has a first surface P4 and a second surface P5 disposed opposite to each other. The first flow channel 21, the second flow channel 22, and the heat insulation cavity 30 are all disposed on the first surface P4, and the heat insulation cavity 30 extends through to the second surface P5. The first surface P4 of the substrate 10 can be sealed by installing a cover plate to close the opening area of ​​the first flow channel 21, the second flow channel 22, and the heat insulation cavity 30 on the first surface P4. The second surface P5 is provided with a first liquid inlet 211, a first liquid outlet 212, a second liquid inlet 221, and a second liquid outlet 222. The first liquid inlet 211 and the first liquid outlet 212 are respectively connected to the two ends of the first flow channel 21, and the second liquid inlet 221 and the second liquid outlet 222 are respectively connected to the two ends of the second flow channel 22, so as to facilitate the connection of the first flow channel 21 and the second flow channel 22 into the circulation channel.

[0058] Referring again to Figure 9 and Figure 1, in one embodiment, a first flow channel 21 and a second flow channel 22 are formed inside the substrate 10. A ninth communication port 213, a sixth communication port 214, a seventh communication port 223, an eighth communication port 224, and a heat insulation cavity 30 are formed on one side surface of the substrate 10. The ninth communication port 213 and the sixth communication port 214 are located on one side of the heat insulation cavity 30, and the seventh communication port 223 and the eighth communication port 224 are located on the other side of the heat insulation cavity 30.

[0059] In this embodiment, the first flow channel 21 supplies hot water flow, and the second flow channel 22 supplies cold water flow. The ninth connecting port 213 connects to the first flow channel 21, and the ninth connecting port 213 can serve as an inlet or outlet. Multiple sixth connecting ports 214 are provided, located on one side of the ninth connecting port 213, and are spaced apart sequentially. Each sixth connecting port 214 can be connected to an external pipe, allowing multiple pipes to simultaneously connect to the first flow channel 21, thereby enabling hot water to flow back into the first flow channel 21 from different pipes.

[0060] The seventh connecting port 223 connects to the second flow channel 22, and the seventh connecting port 223 can serve as either an inlet or an outlet. Multiple eighth connecting ports 224 are provided, located on one side of the seventh connecting port 223, and are spaced apart sequentially. Each eighth connecting port 224 can be connected to an external pipe, allowing multiple pipes to simultaneously connect to the second flow channel 22, thereby enabling cold water to be diverted from the second flow channel 22 to different pipes for heat dissipation from different heat-generating components.

[0061] The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application. [Simplified Explanation of the Diagram]

[0062] In order to more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application, and therefore should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0063] Figure 1 is a schematic diagram of the flow channel structure of this application in one embodiment.

[0064] Figure 2 is a schematic diagram of the flow channel structure of this application from another perspective in one embodiment.

[0065] Figure 3 is a front view schematic diagram of the flow channel structure of this application in one embodiment.

[0066] Figure 4 is a front view schematic diagram of the flow channel structure of this application in another embodiment.

[0067] Figure 5 is a front view schematic diagram of the flow channel structure of this application in another embodiment.

[0068] Figure 6 is a front view schematic diagram of the flow channel structure of this application in another embodiment.

[0069] Figure 7 is a schematic diagram of the flow channel structure of this application in another embodiment.

[0070] Figure 8 is a top view of the flow channel structure in Figure 7 in another embodiment.

[0071] Figure 9 is a schematic diagram of the flow channel structure of this application in another embodiment.

Claims

1. A flow channel structure, improved in that it includes: A substrate has fluid channels and a heat insulation cavity thereon; wherein, the fluid channels are for the flow of a heat-conducting medium, and the number of fluid channels is set to at least two, any two adjacent fluid channels are spaced apart, and the heat insulation cavity is provided between any two adjacent fluid channels; the heat insulation cavity contains a heat insulation medium, which is configured to prevent heat exchange between the heat-conducting medium in the two adjacent fluid channels of the heat insulation cavity; the at least two fluid channels include a first flow channel and a second flow channel, and the heat insulation cavity is provided between the first flow channel and the second flow channel; along a third direction, at least one side of the substrate has an opening, the opening communicating with the heat insulation cavity to divide the substrate into a first region and a second region, the first flow channel is provided on the first region, and the second flow channel is provided on the second region.

2. The flow channel structure as described in claim 1, wherein: The fluid channel extends parallel to the first direction and along the second direction, with the first flow channel and the second flow channel spaced apart, and the second direction intersecting the first direction; wherein, the heat insulation cavity is spaced apart from the first flow channel and the second flow channel.

3. The flow channel structure as described in claim 2, wherein: Along the first direction, the extension length of the heat insulation cavity is greater than or equal to the extension length of the first flow channel and the extension length of the second flow channel.

4. The flow channel structure as described in claim 2, wherein: Along the first direction, the width of the opening is less than the extension length of the heat insulation cavity, so as to form a connection between the first section and the second section, the connection being integrally formed with the first section and the second section.

5. The flow channel structure as described in claim 1, wherein: The flow channel structure also includes a reserved portion. Along a third direction, the reserved portion is connected to one side of the substrate. The reserved portion is provided with a third flow channel, which connects to one of the fluid channels. The reserved portion is also provided with an inlet and outlet, which connect to the third flow channel.

6. The flow channel structure as described in claim 5, wherein: The reserved portion is integrally formed with the substrate.

7. The flow channel structure as described in claim 5, wherein: The at least two fluid channels include a first flow channel and a second flow channel. The third flow channel is inclined to the first flow channel and communicates with the first flow channel. The third flow channel is at least partially located on the side of the second flow channel that is upward towards the reserved portion.

8. The flow channel structure as described in claim 7, wherein: Along the third direction, a heat insulation cavity is provided between the third flow channel and the second flow channel, and the heat insulation medium is provided inside the heat insulation cavity.

9. The flow channel structure as described in claim 1, wherein: The at least two fluid channels include a first flow channel, a second flow channel, and a fourth flow channel; along the second direction, the first flow channel and the second flow channel are spaced apart, and the heat insulation cavity is provided between the first flow channel and the second flow channel; Along a third direction, the fourth flow channel is spaced apart on one side of the first flow channel and the second flow channel, and the heat insulation cavity is provided between the fourth flow channel and the first flow channel and the second flow channel.

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