Module with enlarged thermal contact area, heat dissipation fin and heat dissipation fin manufacturing method thereof

Abstract

This disclosure is directed to a heat dissipation module with enlarged thermal contact area, a heat dissipation fin thereof and a manufacturing method thereof which are applied to solder. The heat dissipation module has a heat dissipation fin group and heat pipes. The heat dissipation fin group has multiple heat dissipation fins arranged in parallel and at intervals, each heat dissipation fin has a plate body, and each plate body has a through hole and one or more blind holes connected to the through hole defined on a front side thereof. Each blind hole is provided with a continuously closed bottom wall, a semi-circular wall integrally formed on an inner edge of the continuously closed bottom wall and a communication opening defined on one side of the semi-circular wall and connected to the through hole. The heat pipes are respectively inserted in the through holes. In each blind hole is disposed with a solder, and the solder is filled into a space between the heat pipe and the inner edge of the through hole via the communication opening. Accordingly, an excellent heat conduction is performed by the heat dissipation module and the heat dissipation fins of this disclosure.

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