Method for measuring deformation level of chip, device for measuring deformation level of chip, computer-readable recording medium and method for stacking semiconductor chips
TW202632222APending Publication Date: 2026-08-01NEXTIN INC
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- NEXTIN INC
- Filing Date
- 2026-01-26
- Publication Date
- 2026-08-01
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Abstract
Provided is a method for measuring a z-axis deformation level of a chip from a two-dimensional image of the chip, the method including: acquiring the two-dimensional image of the chip by scanning a surface of the chip; extracting a feature of the surface of the chip from the two-dimensional image; and measuring the z-axis deformation level of the chip based on the extracted feature.
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