Measuring devices, measuring methods, manufacturing methods of semiconductor devices, and program products

Abstract

This invention provides a measuring device that can reduce errors in thickness or temperature measurements using optical interference. The measuring device of one embodiment includes a light source, a spectrometer, a memory device, and a processor. The memory device stores a first correction table containing measured values ​​of thickness or temperature and their true values, and a second correction table containing measured values ​​of phase angle and their true values. The processor performs a Fourier transform on the spectroscopic waveform measured by the spectrometer; based on the amplitude peak position of the Fourier-transformed waveform, it calculates the thickness or temperature of the object being measured as the first measured value; based on the amplitude peak position of the Fourier-transformed waveform, it calculates the phase angle before phase expansion as the second measured value; it selects a plurality of first and second true value candidates corresponding to the first and second measured values ​​from the first and second correction tables respectively; and outputs the value of the first and second true value candidate that is the same or closest among the selected plurality of first and second true value candidates as the thickness or temperature of the object being measured.

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