Optical coupling verification method

TW202632244APending Publication Date: 2026-08-01HERMES TESTING SOLUTIONS
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
HERMES TESTING SOLUTIONS
Filing Date
2025-04-08
Publication Date
2026-08-01

Smart Images

  • Figure TWG2TA001070066_001
    Figure TWG2TA001070066_001
  • Figure TWG2TA001070066_002
    Figure TWG2TA001070066_002
  • Figure TWG2TA001070066_003
    Figure TWG2TA001070066_003
Patent Text Reader

Abstract

An optical coupling verification method used in a silicon photonic wafer testing system is provided. The silicon photonic wafer testing system includes a wafer prober, coupling actuator device, an optic inspection device, and an integrated control module electrically connected to the wafer prober, the coupling actuator device, and the optic inspection device. A fiber optics array is disposed on the coupling actuator device and located on an optical path generated by the optic inspection device. The optical coupling verification method comprises: receiving a verification kit into the wafer prober. The integrated control module drives an upward camera to align the fiber optics array and drives a downward camera to align the verification kit to obtain a relative position relation of the fiber optics array and the verification, and then performs coupling verification to obtain a characteristics variation of light on the optical path.
Need to check novelty before this filing date? Find Prior Art