Optical coupling verification method
TW202632244APending Publication Date: 2026-08-01HERMES TESTING SOLUTIONS
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- HERMES TESTING SOLUTIONS
- Filing Date
- 2025-04-08
- Publication Date
- 2026-08-01
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Abstract
An optical coupling verification method used in a silicon photonic wafer testing system is provided. The silicon photonic wafer testing system includes a wafer prober, coupling actuator device, an optic inspection device, and an integrated control module electrically connected to the wafer prober, the coupling actuator device, and the optic inspection device. A fiber optics array is disposed on the coupling actuator device and located on an optical path generated by the optic inspection device. The optical coupling verification method comprises: receiving a verification kit into the wafer prober. The integrated control module drives an upward camera to align the fiber optics array and drives a downward camera to align the verification kit to obtain a relative position relation of the fiber optics array and the verification, and then performs coupling verification to obtain a characteristics variation of light on the optical path.
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