Ultra-high sensitivity hybrid inspection with full wafer coverage capability with step and settle stage

Abstract

A hybrid inspection system is disclosed. The hybrid inspection system includes an optical inspection tool configured to identify candidate defects on a sample by directing an illumination beam to the sample with light and collecting scattered light from the sample in response to the illumination beam. The hybrid inspection system includes a multi-column inspection tool to identify defects of interest from the candidate defects, wherein the multi-column inspection tool comprises: two or more columns to simultaneously image two or more measurement regions on the sample and a translation stage configured to secure and position the sample with respect to the two or more columns, wherein the translation stage is configured to image at least a portion of the candidate defects using a step-and-settle sampling plan.

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